蓝宝石衬底晶圆单片清洗设备研制  

Development of Cleaning Process and Equipment for Sapphire Substrate Wafer

作　　者：王晓明 郭明灿 WANG Xiaoming;GUO Mingcan(Department of Mechanical Engineering,Shandong Vocational College of Science and Technology,Weifang 261053,China;Weifang Mingzhe Intelligent Technology Co.,Ltd.,Weifang 261021,China)

机构地区：[1]山东科技职业学院机械工程系,山东潍坊261053 [2]潍坊明哲智能科技有限公司,山东潍坊261021

出　　处：《机械工程师》2023年第7期101-102,105,共3页Mechanical Engineer

基　　金：2020年潍坊市科学技术发展计划项目(2020GX054)。

摘　　要：为提高蓝宝石衬底晶圆清洗质量和效率,对衬底晶圆表面杂质类型和清洗工艺现状进行了分析,并采用单片和湿法清洗工艺,完成了晶圆清洗工艺方案设计和清洗设备的研制,设备采取机器人搭载双机械手实现晶圆的取放,采用可调节高度的清洗海绵头、气雾喷头配合伯努力旋转工作台等实现晶圆的清洗。通过样机试验,晶圆表面清洗效果好,无晶圆二次污染及划伤问题,清洗质量满足工艺和使用要求。In order to improve the quality and efficiency of sapphire substrate wafer cleaning,this paper analyzes the impurities types on the surface of the substrate wafer and the status of wafer cleaning process,designs wafer cleaning process scheme and cleaning equipment by using monolithic and wet cleaning processes.The equipment adopts a robot equipped with two manipulators to realize the wafer picking and placing,and uses a highly adjustable cleaning sponge head,an aerosol nozzle and a Bernoulli rotary workbench to realize the wafer cleaning.The prototype test proves that the wafer surface cleaning effect is good,there is no secondary pollution and scratch problem of the wafer,and the cleaning quality meets the process and use requirements.

关 键 词：晶圆 取片机械手 定位机构 刷片机构 清洗工作台 清洗箱 

分 类 号：TH122[机械工程—机械设计及理论]