高热导氮化硅陶瓷基板材料研究进展  

Research Progress of Silicon Nitride Ceramic Substrate Materials with High Thermal Conductivity

作　　者：雷张 李洪滔 张春艳[1] 田中青[1] 曹亮亮 孟范成[1] LEI Zhang;LI Hongtao;ZHANG Chunyan;TIAN Zhongqing;CAO Liangliang;MENG Fancheng(School of Materials Science and Engineering,Chongqing University of Technology,Chongqing 400054,China;Xingxin areospace advanced materials(shanghai)co.ltd,Shanghai 200333,China)

机构地区：[1]重庆理工大学材料科学与工程学院,重庆400054 [2]星鑫宇航新材料科技(上海)有限公司,上海200333

出　　处：《中国陶瓷》2023年第7期1-9,20,共10页China Ceramics

基　　金：中国科学院无机功能材料与器件重点实验室开放课题(KLIFMD-2018-06)。

摘　　要：氮化硅陶瓷具有耐高温、高强度、高硬度、高热导的特点,是大功率电子元器件散热基板的重要材料。针对高热导氮化硅陶瓷材料,阐述了影响氮化硅陶瓷热导率的关键因素,综述了高热导氮化硅陶瓷材料的研究和制备现状,展望了高热导氮化硅陶瓷基板材料的未来发展与应用前景。Silicon nitride ceramics are characterized by high temperature resistance, high strength, high hardness and high thermal conductivity, and are important materials for heat dissipation substrates of highpower electronic components. In this paper, the key factors affecting the thermal conductivity of silicon nitride ceramics are described, the research and manufacture status of the high thermal conductivity silicon nitride ceramics is reviewed, and the future development and application prospects of the high thermal conductivity silicon nitride ceramic substrate materials are projected.

关 键 词：氮化硅 高热导 研究现状 陶瓷基板材料 

分 类 号：TQ174.758.12[化学工程—陶瓷工业]