车用集成电路无铅焊球可靠性与剪切方法分析  

Analysis of Reliability and Shearing Method of Lead-free Solder balls in Automobile IC

作　　者：菅端端[1] 任翔[1] 时慧 

机构地区：[1]中国电子技术标准化研究院

出　　处：《信息技术与标准化》2023年第7期34-38,43,共6页Information Technology & Standardization

摘　　要：针对球栅阵列封装的车用集成电路高可靠应用要求,分析了无铅焊球的结构与失效模式间的关系。通过比较车用集成电路剪切测试标准与通用标准的差异,提出了焊球剪切测试过程中速率、位置、角度等影响测试结果的因素,并通过试验评估了各因素对测试结果的影响程度,为用户产品通过鉴定试验提供支撑。The relationship between the structure of lead-free solder balls and the failure mode is analyzed for the high reliability of Ball Grid Array packaged automotive integrated circuits.By comparing the difference between the automobile chip shear test standard and the general standard,the factors that affect the test result during the solder balls shear test were put forward,such as speed,position,angle,etc.The influence degree of each factor on the test result was evaluated through the test,aiming to provide support for the user's products to pass the identification test.

关 键 词：剪切测试 无铅焊料合金 焊点 剪切速率 

分 类 号：TN405[电子电信—微电子学与固体电子学] U463.6[机械工程—车辆工程]