潮湿颗粒电解质电化学机械抛光铜工件的接触特性研究  

Study on Contact Characteristics of Moist Particle Electrolyte Electrochemical Mechanical Polishing of Copper Workpiece

作　　者：董志刚[1] 程吉瑞 高尚[1] 康仁科[1] DONG Zhigang;CHENG Jirui;GAO Shang;KANG Renke(Key Laboratory for Precision and Non-Traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024

出　　处：《航空制造技术》2023年第13期38-45,72,共9页Aeronautical Manufacturing Technology

基　　金：国家自然科学基金面上项目(51975095);大连市高层次人才创新支持计划(2020RD02);辽宁省“兴辽英才计划”杰出人才项目(XLYC2001004)。

摘　　要：潮湿颗粒电解质电化学机械抛光(Moist particle electrolyte electrochemical mechanical polishing,MPEECMP)作为新兴技术,仍存在难以获得高表面质量的问题。为解决该问题,深入研究电解质颗粒与工件的接触特性,采用离散元仿真软件Altair EDEM探究了工件倾斜角、转速对接触数量、接触力的影响规律,并进行MPE-ECMP工艺试验。研究结果表明,倾斜角为30°时,单位时间内电解质颗粒与工件的接触数量最多,且切向力最大,为3.38 mN;在90°时,切向力最小,为1.21 mN。随着工件转速增大,单位时间内电解质颗粒与工件的接触数量变少,电解质颗粒与工件接触的法向力、切向力呈增大趋势。当抛光电位(vs.Hg/Hg_(2)SO_(4))为0.8 V,工件倾斜角为30°,抛光1 h,表面粗糙度从S_(a)433.51 nm降低到S_(a)22.43 nm,降低了94.8%。结果证明了工件倾斜角、转速的调整可有效提高MPE-ECMP的抛光精度,表面粗糙度的降低是由接触数量及接触力共同决定的,EDEM可有效模拟电解质颗粒运动的流态特性,为MPE-ECMP的进一步研究奠定了基础。Moist particle electrolyte electrochemical mechanical polishing(MPE-ECMP)is an emerging technology that has difficulties in obtaining high-surface quality workpieces.In order to solve this problem,the contact characteristics of the workpiece and electrolyte particles were investigated,and the discrete element simulation software Altair EDEM was used to explore the influence of workpiece inclination angle and speed on the number of contacts and contact force.The results show that when the inclination angle is 30°,the contact number between electrolyte particles and the workpiece per unit time is the largest,and the tangential force is the largest,which is 3.38 mN.The tangential force is the smallest at 90°,1.21 mN.As the rotational speed of the workpiece increases,the number of electrolyte particles in contact with the workpiece per unit of time becomes less,and the normal and tangential forces of electrolyte particles in contact with the workpiece tend to increase.When the polishing potential(vs.Hg/Hg_(2)SO_(4))is 0.8 V and the workpiece is tilted at 30°for 1 h,the surface roughness is reduced from S_(a)433.51 nm to S_(a)22.43 nm,and the surface roughness is reduced by 94.8%.The results demonstrate that the adjustment of workpiece tilt angle and rotational speed can effectively improve the polishing accuracy of MPE-ECMP,the reduction of surface roughness is jointly determined by the number of contacts and contact force,and EDEM can effectively simulate the flow characteristics of electrolyte particle motion,which lays the foundation for further research of MPE-ECMP.

关 键 词：潮湿颗粒电解质电化学机械抛光(MPE-ECMP) 离散元法 流场轨迹 接触特性 表面质量 

分 类 号：TG175[金属学及工艺—金属表面处理]