纳秒紫外激光修复高密度铜印制线路板研究  

Research on Nanosecond Ultraviolet Laser Repairing of High-Density Copper Printed Circuit Board

作　　者：曾宇杰[1] 徐广东 吴松 杨冠南 崔成强 ZENG Yujie;XU Guangdong;WU Song;YANG Guannan;CUI Chengqiang(State Key Laboratory of Precision Electronics Manufacturing Technology and Equipment,Guangdong University of Technology,Guangzhou 511400,China)

机构地区：[1]广东工业大学省部共建精密电子制造技术与装备国家重点实验室,广州511400

出　　处：《电子与封装》2023年第7期5-9,共5页Electronics & Packaging

基　　金：国家自然科学基金(62204063);广东省基础与应用基础研究基金(2021A1515110656)。

摘　　要：采用液相还原法制取纳米铜颗粒,与乙二醇溶剂混合配成膏体,利用紫外激光修复铜印制线路板上线路的缺失部分。探究了不同激光功率对修复后的线路形貌以及各项性能的影响,得出最佳工艺参数。修复后线路的电阻值与激光功率的关系并未呈现出明显规律。在激光功率为0.4 W、速度为100 mm/s、频率为150 k Hz时,激光修复后的线路表面平整且无裂痕,其电阻只有0.2Ω(电阻率为4×10^(-6)Ω·m)。经过弯曲测试,弯折处的铜线路受应力影响发生部分分离,线路的电阻值随弯曲次数的增多呈增长趋势,4次弯曲后的电阻值是未弯折时电阻值的9倍。Copper nanoparticles are prepared by liquid-phase reduction method and mixed with ethylene glycol solvent to form a paste.UV laser is used to repair the missing part of the circuit on copper printed circuit boards.The effects of different laser power on the morphology and properties of the repaired wires are investigated,and the optimal process parameters are obtained.The relationship between the resistance value and laser power of the repaired wires doesn’t show a clear pattern.The best performance of the repaired wires is obtained with a laser power of 0.4 W,a speed of 100 mm/s,and a frequency of 150 kHz,and the laser-repaired wires have a flat and crack-free surface.The resistance is only 0.2Ω(with a resistivity of 4×10^(-6)Ω·m).After bending test,the copper wires at the bend are partially separated due to stress,and the resistance values of the wires show an increasing trend with the increase of bending times.The resistance value after 4 bends is 9 times higher than that before bending.

关 键 词：纳米铜颗粒 线路修复 激光烧结 

分 类 号：TN305.94[电子电信—物理电子学]