封装用环氧银胶的配制工艺及性能研究  

Study on Preparation Technology and Properties of Epoxy Silver Adhesive Used for Encapsulation

作　　者：鄂依阳 田兆波 迟克禹 江仁要 孙琪 吕尤 祝渊 E Yiyang;TIAN Zhaobo;CHI Keyu;JIANG Renyao;SUN Qi;LYU You;ZHU Yuan(School of Innovation and Entrepreneurship,Southern University of Science and Technology,Shenzhen 518055,China;School of Microelectronics,Southern University of Science and Technology,Shenzhen 518055,China;Shenzhen Baopeng New Materials Technology Co.,Ltd.,Shenzhen 518055,China;FoShan(Southern China)Institute for New Materials,Foshan 528000,China;Engineering Research Center of Integrated Circuits for Next-Generation Communications,Southern University of Science and Technology,Shenzhen 518055,China)

机构地区：[1]南方科技大学创新创业学院,广东深圳518055 [2]南方科技大学深港微电子学院,广东深圳518055 [3]深圳市宝硼新材料科技有限公司,广东深圳518055 [4]佛山(华南)新材料研究院,广东佛山528000 [5]南方科技大学未来通信集成电路教育部工程研究中心,广东深圳518055

出　　处：《电子与封装》2023年第7期40-45,共6页Electronics & Packaging

基　　金：国家优秀青年基金(52122607);国家自然科学基金(U20A20241,52002208,52272114);深圳科创委基金(JCYJ20210324104608024)。

摘　　要：随着电子设备向小型化和轻量化发展,电子封装也趋于小尺寸、精密化和结构复杂化。传统钎焊互连越来越难以解决精密的封装结构产生的散热问题。银胶作为一种高性能、低污染和易操作的新型互连材料,逐渐替代钎焊并在高端芯片互连等领域发挥着越来越重要的作用。针对市场银胶热导率和电阻率难以满足需求的难题,采用环氧树脂、片状银粉、改性脂环胺固化剂、偶联剂、稀释剂和催化剂改善了环氧树脂基银胶,系统研究了银粉形貌、比例和制备工艺等对银胶热导率和电阻率等的影响,并获得了高热导率[7.21 W·(m·K)^(-1)]、低体积电阻率(4.46×10^(-5)Ω·cm)的环氧银胶。通过在不同基板间进行粘接热阻测试,验证了所获得的环氧银胶在基板间具有较低的热阻,其有望应用于高端芯片封装的互连。With the development of miniaturization and lightweight of electronic devices,electronic packaging is also tending to be smaller in size,and more precise and complex in structure.Traditional soldering interconnects are becoming increasingly difficult to solve the heat dissipation problems caused by the precision packaging structures.As a new type of interconnect material with high performance,low pollution and easy operation,silver adhesive is gradually replacing soldering and playing an increasingly important role in high-end chip interconnection and other fields.In response to the difficulty that the thermal conductivity and resistivity of silver adhesive in the market can hardly meet the demand,the epoxy resin,flake silver powder,modified alicyclic amine curing agent,coupling agent,diluent and catalyst are used to improve the epoxy resin-based silver adhesive,and the effects of silver powder morphology,ratio and preparation process on the thermal conductivity and resistivity of silver adhesive are systematically studied.High thermal conductivity[7.21 W·(m·K)^(-1)]and low volume resistivity(4.46×10^(-5)Ω·cm)of epoxy silver adhesive are abtained.Through the bonding thermal resistance test between different substrates,it is verified that the obtained epoxy silver adhesive has lower thermal resistance between substrates,which is expected to be applied to the interconnection of high-end chip packaging.

关 键 词：银胶 热导率 体积电阻率 热阻 

分 类 号：TN305.94[电子电信—物理电子学]