高可靠高性能高密度倒扣封装设计与验证研究  

Design and Verification of High Reliability,High Performance,and High Density Inverted Packaging

作　　者：张爱丽 Zhang Aili(Shanghai Fudan Microelectronics Group Company Limited,Shanghai,China)

机构地区：[1]上海复旦微电子集团股份有限公司,上海

出　　处：《科学技术创新》2023年第20期9-13,共5页Scientific and Technological Innovation

摘　　要：随着半导体芯片集成程度越来越高,传统的封装形式受到挑战。为达到高性能高密度超大规模器件的封装既能满足高速数据传输需求,又能满足高可靠应用的需求的目标,本文基于新研的一种新型的FCCGA(Flip Chip Column Grid Array,倒装柱栅阵列)封装结构,设计了一款外形尺寸42.5 mm×42.5 mm,引出脚间距1.0 mm,引出脚数量1760,数据速率高达15 Gbps的FCCGA1760器件。通过仿真温度循环疲劳寿命为2550次-55℃~100℃循环,装联后通过振动和200次-55℃~100℃循环,且金相分析结果表明FCCGA1760结构通过可靠性试验验证,满足高可靠的应用需求。With the increasing integration level of semiconductor chips,traditional packaging forms are facing challenges.In order to achieve the goal of packaging high-performance,high-density,and ultra large scale devices that can meet the requirements of high-speed data transmission and high reliability applications,this paper proposes a new type of FCCGA(Flip Chip Column Grid Array)packaging structure based on a newly developed FCCGA(Flip Chip Column Grid Array).A FCCGA1760 device with an overall size of 42.5mm×42.5mm,a pin spacing of 1.0mm,a number of 1760 pins,and a data rate of up to 15 Gbps is designed.Through simulation,the fatigue life of Temperature cycling is 2550 times-55℃~100℃ cycles.After assembly,it passes vibration and 200 times-55℃~100℃ cycles.The metallographic analysis results show that the FCCGA1760 structure has passed the reliability test verification and meets the requirements of high reliability applications.

关 键 词：FCCGA 倒扣封装 有机基板 焊柱 

分 类 号：TN405[电子电信—微电子学与固体电子学]