三维多孔氮化铝/环氧树脂复合材料的导热与电性能  

Thermal conductivity and electrical properties of three-dimensional porous aluminum nitride/epoxy composites

作　　者：王绪彬 张昌海 张天栋[1,2] 迟庆国 WANG Xubin;ZHANG Changhai;ZHANG Tiandong;CHI Qingguo(School of Electrical and Electronic Engineering,Harbin University of Science and Technology,Harbin 150080,China;Key Laboratory of Engineering Dielectrics and Its Application,Ministry of Education,Harbin University of Science and Technology,Harbin 150080,China)

机构地区：[1]哈尔滨理工大学电气与电子工程学院,哈尔滨150080 [2]哈尔滨理工大学工程电介质及其应用教育部重点实验室,哈尔滨150080

出　　处：《复合材料学报》2023年第6期3341-3349,共9页Acta Materiae Compositae Sinica

基　　金：黑龙江省自然科学基金(ZD2020 E009)。

摘　　要：环氧树脂(EP)是一种典型的电子封装绝缘材料,但其导热系数(小于0.2 W/(m·K))较低,提高其导热性是解决电子器件散热问题的有效办法。本文通过构筑三维多孔的氮化铝骨架(3D-AlN),制备得到3DAlN/EP复合材料。SEM形貌和XRD物相表征结果证实3D-AlN骨架及3D-AlN/EP复合材料的成功制备。利用TGA精确测量3D-AlN骨架所占复合材料的质量分数,通过与含有不同含量随机分布的AlN/EP(Random AlN/EP)复合材料对比发现,3D-AlN/EP复合材料的导热系数要高于Random AlN/EP复合材料,45.48wt%3DAlN/EP复合材料的室温(25℃)导热系数为1.00 W/(m·K),是纯EP(0.18 W/(m·K))的5.6倍。利用理论模型(Fogyel、Agari)计算复合材料的界面热阻,发现3D-AlN/EP复合材料相比于Random AlN/EP具有更低的填料与填料间界面热阻,分别为2.704×10^(5)K·W^(−1)、4.019×10^(5)K·W^(−1)。电性能测试结果表明,45.48wt%3D-AlN/EP复合材料具良好的介电性能及绝缘性能(体积电阻率为4.16×10^(11)Ω·cm)。本研究从封装绝缘材料改性角度为电子器件散热问题提供了一种有效解决方案。Epoxy resin(EP)is a typical insulating material for electronic packaging,but its thermal conductivity(less than 0.2 W/(m·K))is low,and improving its thermal conductivity is an effective way to solve the heat dissipation problem of electronic devices.In this paper,3D-AlN/EP composites were prepared by constructing a threedimensional porous aluminum nitride skeleton(3D-AlN).The SEM morphology and XRD phase characterization results confirmed the successful preparation of 3D-AlN skeleton and 3D-AlN/EP composites.The mass fraction of the composite accounted for by the 3D-AlN skeleton was precisely measured using TGA,and by comparing with different contents of random distribution AlN/EP(Random AlN/EP)composites,it was found that the thermal conductivity of 3D-AlN/EP composites was higher than that of Random AlN/EP composites,the thermal conductivity of the 45.48wt%3D-AlN/EP composite at room temperature(25℃)was 1.00 W/(m·K),which was 5.6 times higher than that of pure EP(0.18 W/(m·K)).The interfacial thermal resistance of the composites was calculated using the theoretical model(Fogyel,Agari),and it was found that the 3D-AlN/EP composites had lower filler-to-filler interfacial thermal resistance compared to Random AlN/EP,with 2.704×10^(5)K·W^(−1)and 4.019×10^(5)K·W^(−1),respectively.The electrical properties showed that the 45.48wt%3D-AlN/EP composite had good dielectric and insulating properties(volume resistivity is 4.16×10^(11)Ω·cm).This study provides an effective solution to the heat dissipation problem of electronic devices from the perspective of package insulation material modification.

关 键 词：环氧树脂 复合材料 三维网络 导热 电性能 电子封装 

分 类 号：TM215.92[一般工业技术—材料科学与工程] TB332[电气工程—电工理论与新技术]