柔性电子聚合物表面金属化工艺的研究进展  

Research progress on surface modification technology of flexible electronic polymers

作　　者：张超[1] 马迅 王静静[1] 刘平[1] 马凤仓[1] 张柯[1] 李伟[1] ZHANG Chao;MA Xun;WANG Jingjng;LIU Ping;MA Fengcang;ZHANG Ke;LI Wei(School of Materials and Chemistry,University of Shanghai for Science and Technology,Shanghai 200093,China)

机构地区：[1]上海理工大学材料与化学学院,上海200093

出　　处：《功能材料》2023年第7期7080-7092,共13页Journal of Functional Materials

基　　金：国家自然科学基金项目(51971148)。

摘　　要：柔性聚合物具有低密度,极高的柔韧性和可变形等特点,可作为柔性电子器件的基材广泛应用于射频通讯天线、传感检测、医疗健康和微电子等领域。由于柔性聚合物的低导电性和较差的机械特性,限制了其进一步的发展。化学镀、激光成型和真空沉积镀膜等工艺方法可有效改善柔性聚合物的电学、光学等物理性能,成为近几年的研究热点,为柔性电子器件制备的图案化、微型化和可定制化提供了有效的解决方案。总结近年来在柔性电子领域常见的表面金属化工艺的研究进展,详细论述了工艺参数对柔性电子材料在性能上的影响规律及作用机制,指出其具备的优势和不足,并对未来的发展方向做出展望。Flexible electronic devices are widely used in radio-frequency communication antennas,sensor detection,medical health,microelectronics,and other fields.On account of the low density,extremely high flexibility,and deformability of polymers,they can satisfy the requirement of flexible electronic devices for customization and versatility.Besides,the further development was restricted to the low conductivity and poor mechanical properties of flexible polymers,based on the above challenges,there has been an increased research focus on the representative of modern technology such as electroless plating,laser molding,and vacuum deposition,which provided the significant solutions for surface patterning,miniaturization,and customization for flexible electronic device.This review summarizes the research progress of surface metallization processes of flexible polymers in recent years,and the fundamental principles and the rules of these techniques are discussed along with the process parameters and indicated the strengths and weaknesses,followed by an exploration of the latest progress and future prospects in the field.

关 键 词：柔性电子聚合物 表面金属化 化学镀 激光改性 真空沉积 

分 类 号：TB34[一般工业技术—材料科学与工程]