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作 者:陆彬 焦晨 叶昀 赵剑峰[1] 谢德巧 沈理达[1] 徐原野 LU Bin;JIAO Chen;YE Yun;ZHAO Jianfeng;XIE Deqiao;SHEN Lida;XU Yuanye(College of Mechanical and Electronic Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)
机构地区:[1]南京航空航天大学机电学院,江苏南京210016
出 处:《热加工工艺》2023年第10期85-90,95,共7页Hot Working Technology
基 金:江苏省科技厅重点研发计划项目(BE2019002);中国博士后基金项目(2020M671475,2020M671455,2020TQ0141)
摘 要:提出了一种在光固化成形的复杂陶瓷结构表面进行选择性金属化的完整工艺流程。利用光固化成形在制造复杂陶瓷结构领域内的优势,配合金属刻划在陶瓷表面留下活性金属层,最后结合化学镀铜工艺,在常温下实现三维结构以及陶瓷内表面以及复杂陶瓷表面可控定向金属化。结果表明,所得到的铜镀层具有精确度高,粗糙度小的特点,并且与基体具有优秀的结合力以及良好的可焊性。四探针电阻仪测得铜层的电阻率约为1.03 mΩ·cm。以该工艺路线制备了以Al2O3陶瓷为基体的天线结构等应用实例。实例表明,本文提出的光固化成形Al2O3以及表面金属化方法可实现复杂陶瓷微波器件的快速制造,为满足航空航天等特殊应用场景的微波器件提供了新设计制造思路。The complete process of selective metallization on the surface of complex ceramic structure formed by light curing was proposed.Taking advantage of light curing in the field of manufacturing complex ceramic structure,and then,the active metal layer was left on the surface of ceramic with metal engraving,finally,combined with the chemical copper plating process,the controllable directional metallization of three-dimensional structure,internal surface and complex ceramic surface can be realized at room temperature.The results show that the copper coating manufactured by this method has the characteristics of high precision and small roughness,and has excellent bonding force and good weldability.The resistivity of the copper layer measured by using a four-probe resistance meter is about 1.03 mΩ·cm.Finally,antenna and other structures based on alumina ceramic is manufactured by this process.The examples show that the method of light curing and surface metallization can realize the rapid manufacturing of complex ceramic microwave devices,and provide new design and manufacturing ideas for microwave devices meeting the special application scenarios on aeronautics and astronautics.
分 类 号:TG113.2[金属学及工艺—物理冶金] TG146.1[金属学及工艺—金属学]
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