SPC在SMT质量控制中的应用  

Application of SPC in SMT Quality Control

作　　者：高虎 GAO Hu(Lianyungang Jari Electronics Co.,Ltd.,Lianyungang 222006,China)

机构地区：[1]连云港杰瑞电子有限公司,江苏连云港222006

出　　处：《电子质量》2023年第7期94-98,共5页Electronics Quality

摘　　要：介绍了统计过程控制(SPC)的核心工具之控制图的分类及其核心技术,详细地阐述了控制图的选取流程。首先,分析了不同工序对表面组装技术(SMT)生产质量的影响;然后,通过对缺陷的分析判断,选取了对SMT加工质量影响最大的焊膏印刷工序作为改进对象;最后,针对焊膏厚度的计量值数据特性,选择了X-R控制图。通过采集数据、绘制控制图和数据分析,既可以及时发现工艺异常并进行纠正,又可以排除非工艺原因造成的异常,对于提高工艺稳定性和产品质量有着非常重要的意义。The classification and core technology of control chart,the core tool of statistical process control(SPC),are introduced,and the selection process of control chart is elaborated.Firstly,the impact of different processes on surface mounted technology(SMT)production quality is analyzed.Then,through the analysis and judgment of defects,the solder paste printing process which has the greatest impact on SMT processing quality is selected as the improvement object.Finally,aiming at the characteristics of the measurement value data of the solder paste thickness,X-R control chart is selected.Through the collection of data,the drawing of the control chart and the data analysis,the process anomalies can be found and corrected in time,and the anomalies caused by non-process reasons can be eliminated,which is of great significance to improve the process stability and product quality.

关 键 词：统计过程控制 表面组装技术 控制图 焊膏印刷 

分 类 号：TN762[电子电信—电路与系统] F273.2[经济管理—企业管理]