晶圆测试产品表面悬浮粒子沉积问题研究  

Study on the Deposition of Suspended Particles on the Surface of Wafer Testing Products

作　　者：蒋晨瑜 JIANG Chenyu(Unimos Microelectronics(Shanghai)Co.,Ltd.,Shanghai 201712)

机构地区：[1]宏茂微电子(上海)有限公司,上海201712

出　　处：《现代制造技术与装备》2023年第5期15-18,共4页Modern Manufacturing Technology and Equipment

摘　　要：通过研究分析既有晶圆探针测试设备的运行过程,查找晶圆产品表面空气悬浮粒子的沉积原因,进一步探究粒子的来源和传播路径,从而发现晶圆测试工艺中生产设备在设计或车间布局方面的不足,以便针对性地进行改进。By studying and analyzing the operation process of the existing wafer probe testing equipment,the reasons for the deposition of airborne particles on the surface of wafer products are found,and the source and propagation path of particles are further explored,so as to find the shortcomings of the production equipment in the design or workshop layout of wafer testing technology,in order to make targeted improvements.

关 键 词：晶圆测试 悬浮粒子 沉积 

分 类 号：TN405[电子电信—微电子学与固体电子学]