引线键合界面切向接触的黏滞-微滑移临界转换位置和能量耗散特性研究  

Investigation into the characteristics of stick-microslip critical position and energy dissipation in tangential contact of the wire bonding interface

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作  者:温琪 孙韵韵 巫世晶[1] WEN Qi;SUN Yunyun;WU Shijing(School of Power and Mechanical Engineering,Wuhan University,Wuhan 430072,China)

机构地区:[1]武汉大学动力与机械学院,湖北武汉430072

出  处:《中南大学学报(自然科学版)》2023年第7期2674-2682,共9页Journal of Central South University:Science and Technology

基  金:国家自然科学基金资助项目(52105270)。

摘  要:针对键合界面的黏滞-微滑移接触现象,基于黏滞-微滑移临界位置的连续变形条件和边界条件,建立键合界面切向接触的数学模型;推导出键合界面切向接触不同位置的变形量,研究法向键合力和超声切向力对界面黏滞-微滑移临界转换位置和能量耗散的影响规律。研究结果表明:当增大超声切向力或减小法向键合力时,界面切向变形量呈非线性增加,微滑区自边缘向内延展,引线键合界面的黏滞区半径减小;当界面中心位置刚度等于单位刚度时,黏滞区半径与法向键合力呈正相关,与超声切向力呈负相关;当键合界面切向接触变形量增加时,微滑移区域产生的能量耗散呈非线性上升。Based on the stick-microslip contact behavior of bonding interface,a mathematical model for tangential contact of bonding interface was established considering the continuous deformation conditions at the stickmicroslip critical transition position and boundary conditions.By using the proposed model,the tangential contact deformation at different positions of bonding interface was deduced.Influences of normal bonding force and ultrasonic-induced tangential force on the stick-microslip critical transition position and energy dissipation of bonding interface were studied.The results show that when the ultrasonic-induced tangential force increases or normal bonding force decreases,the tangential contact deformation of bonding interface rises nonlinearly,microslip region extends inward from the edge,and the radius of stick region declines.As the equivalent stiffness at center position is equal to the unit length stiffness,the radius of stick region is positively correlated with normal bonding force while negatively correlated with ultrasonic-induced tangential force.With the growth of tangential contact deformation,the energy dissipation of microslip region goes up nonlinearly.

关 键 词:键合界面 黏滞-微滑移 切向变形量 能量耗散 

分 类 号:TH11[机械工程—机械设计及理论]

 

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