多功能传感器集成综述  

Review of Multifunction Sensor Integration

作　　者：吕佩珏 黄哲 王晓明 杨知雨 林晨希 王铭强 杨洋 胡然 苟秋 李嘉怡 金玉丰[1] LYU Peijue;HUANG Zhe;WANG Xiaoming;YANG Zhiyu;LIN Chenxi;WANG Mingqiang;YANG Yang;HU Ran;GOU Qiu;LI Jiayi;JIN Yufeng(Peking University Shenzhen Graduate School,Shenzhen 518055,China)

机构地区：[1]北京大学深圳研究生院,广东深圳518055

出　　处：《电子与封装》2023年第8期1-12,共12页Electronics & Packaging

摘　　要：随着5G、智能汽车、物联网(IoT)、智慧医疗等市场的快速增长,其对传感器需求广泛,要求传感器具备微型化、集成化、智能化、低功耗等特点。概述了国内外学者在环境、汽车和生物参数检测等领域应用多功能传感器集成的成果,阐释了多功能传感器集成的工艺兼容性及封装的关键技术,分析了多功能传感器集成在模型仿真、产品测试和热管理方面面临的严峻挑战。对多功能传感器集成方案进行了总结,并提出了未来发展趋势。With the rapid growth of markets such as 5G,smart cars,internet of things(loT)and smart healthcare,there is an extensive demand for sensors,requiring sensors to have characteristics such as miniaturization,integration,intelligence and low power consumption.The achievements of domestic and international scholars in the application of multifunctional sensor integration in the fields of environment,automotive and biological parameter detection are outlined,the key technologies of process compatibility and packaging for multifunctional sensor integration are explained,and the severe challenges of multifunctional sensor integration in terms of model simulation,product testing and thermal management are analyzed.The multifunction sensor integration solutions are summarized and the future development trends are proposed.

关 键 词：多功能传感器 集成 MEMS-CMOS 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]