金刚石线锯锯切β-Ga_(2)O_(3)晶体应力场分析  

Stress Field Analysis of Diamond Wire Sawing β-Ga_(2)O_(3) Crystal

作　　者：李宗平 程大猛 LI Zongping;CHENG Dameng(Shandong Science and Technology Service Development Promotion Center,Jinan 250101,China;School of Mechanical Engineering,Shandong University,Jinan 250061,China)

机构地区：[1]山东省科技服务发展推进中心,济南250101 [2]山东大学机械工程学院,济南250061

出　　处：《人工晶体学报》2023年第8期1378-1385,共8页Journal of Synthetic Crystals

基　　金：国家重点研发计划(2022YFB3401902)。

摘　　要：作为典型的硬脆材料,氧化镓晶体(β-Ga_(2)O_(3))加工时易裂解。金刚石线锯是生产β-Ga_(2)O_(3)晶片的主要方式,切片加工过程中会在晶片表面产生微裂纹损伤层,应力作用下微裂纹会发生扩展,导致材料破碎和断裂。本文建立了金刚石线锯多线切割β-Ga_(2)O_(3)(010)晶面的有限元模型,研究了锯切过程中机械应力、热应力和热力耦合应力的分布变化规律,分析了锯丝速度、进给速度和恒速比下不同参数组合对热力耦合应力的影响。结果表明,锯切过程中锯切热产生的热应力占据热力耦合应力的主导地位,锯切力引起的机械应力占比较小,但机械应力会影响热力耦合应力的分布情况,锯丝速度和进给速度的增加会引起热力耦合应力的增加。As a typical hard and brittle material,gallium oxide crystal(β-Ga_(2)O_(3))is easy to crack during processing.Diamond wire saw is the main way to produceβ-Ga_(2)O_(3)wafers.During the slicing process,a microcrack damage layer will be generated on the surface of the wafer.Under the stress,the microcracks will expand,leading to material breakage and fracture.In this paper,a finite element model of diamond wire sawing ofβ-Ga_(2)O_(3)(010)crystal surface was established.The distribution of mechanical stress,thermal stress,and thermal-mechanical coupling stress during the sawing process were studied.The effects of sawing wire speed,feed speed and different parameter combinations under constant speed ratio on the thermal-mechanical coupling stress were analyzed.The research results show that:the thermal stress generated by sawing heat dominates the thermal-mechanical coupling stress during the sawing process;the mechanical stress caused by sawing force has a small numerical value and proportion,but it affects the distribution of thermal-mechanical coupling stress;increasing sawing wire speed and feed speed will increase the thermal-mechanical coupling stress.

关 键 词：β-Ga_(2)O_(3) 金刚石线锯 有限元分析 热力耦合应力 机械应力 热应力 

分 类 号：O786[理学—晶体学] TQ133.5[化学工程—无机化工]