底部填充胶对器件可靠性的影响  

Effect of Underfill on Device Reliability

作　　者：张成浩 蒋庆磊[1] ZHANG Chenghao;JIANG Qingei(The 14th Research Institute of CETC,Nanjing 210039,China)

机构地区：[1]中国电子科技集团公司第十四研究所,南京210039

出　　处：《电子工艺技术》2023年第4期25-28,共4页Electronics Process Technology

摘　　要：在电子封装领域,采用底部填充胶进行器件加固已经成为了一种常见工艺手段,然而,底部填充胶对于器件可靠性的影响还需要进一步研究。介绍了底部填充技术以及加固原理,对底部填充胶的加固效果进行了整理分析。发现在芯片的焊装过程中,使用底部填充胶能够明显提升可靠性;对于塑封器件及陶封器件,其可靠性与所选用底部填充胶的热膨胀系数有关。当底部填充胶热膨胀系数与基板/印制板的热膨胀系数相匹配时,可提升器件可靠性;若不匹配,反而会降低可靠性。研究结果表明,底部填充胶的热膨胀系数是影响器件可靠性的重要参数,选用与器件基板热膨胀系数相近的底部填充胶能够有效提高器件的可靠性。In the field of electronic packaging,it has become a commom technology to reinforce devices with underfill.However,the influence of underfill on reliability needs further study.The underfill technology and reinforcement principle are introduced,the reinforcement effect of the underfill is analyzed.It is found that using underfill during chip soldering can significantly improve reliability of chip.For plastic packaging devices and ceramic packaging devices,their reliability is related to the coefficient of thermal expansion of the selected underfill.When the CTE of the underfill is matched with the substrate/PCB,the reliability of the device can be improved,If not,the reliability will be reduced.The results show that the CTE of the underfill is an important parameter affecting the reliability of the device,and the reliability of the device can be effectively improved by selecting the underfill which is similar to the CTE of the device substrate.

关 键 词：底部填充胶 可靠性 芯片 塑封器件 陶封器件 

分 类 号：TN605[电子电信—电路与系统]