射频微波MLCC端电极的缺陷分析  

Defect Analysis of Termination Electrode of RF MLCCs

作　　者：黄木生 向勇 杨万举 江孟达 林显竣 杨玉莹 HUANG Musheng;XIANG Yong;YANG Wanju;JIANG Mengda;LIN Xianjun;YANG Yuying(Guangdong Viiyong Electronic Technology Co.,Ltd.,Luoding 518057,China)

机构地区：[1]广东微容电子科技有限公司,广东罗定527200

出　　处：《电子工艺技术》2023年第4期29-32,共4页Electronics Process Technology

摘　　要：研究了大尺寸射频微波MLCC封端烘干条件、烧端工艺条件对端电极缺陷的影响。结合铜端电极浆料的TGA/DSC分析曲线,以及对封端烧端电镀加工后的MLCC半成品和成品进行破坏性物理分析,评估端头致密性。通过调整封端烘干预处理温度和次数,以及烧铜温度、升温速率、保温时间、烧铜气氛,确定优化条件,获得合格的封端样品、合格的烧端半成品以及电镀成品,达到消除射频微波MLCC端电极缺陷,提高产品可靠性的目的。最终使得射频微波MLCC在通信基站、WLAN、卫星电视设备、航空航天等领域的射频电路中满足高可靠、高SRF、低ESR、高Q值、高电流承载能力的应用需求。The influence of drying condition and curing condition on termination electrode defect of large size RF microwave MLCC is studied.Combined with the TGA/DSC curve of the copper terminal paste and the destructive physical analysis(DPA) of the MLCC products after curing and electroplating,the densification of the copper termination is evaluated.The optimization conditions are determined by adjusting the drying pretreatment temperature and times,curing temperature,heating rate,holding time,curing atmosphere,the qualified sealing samples,curing samples and electroplating finished products can be obtained.The defects of termination electrode of RF microwave MLCC are eliminated and the reliability of the products is improved.Finally,the RF microwave MLCC can meet the application requirements of high reliability,high SRF,low ESR,high Q value and high current carrying capacity in radio frequency circuits such as communication base stations,WLAN,satellite TV equipment and aerospace.

关 键 词：贱金属电极 射频微波 片式多层陶瓷电容器 端电极 缺陷 

分 类 号：TN405[电子电信—微电子学与固体电子学]