负性光敏聚酰亚胺材料研究进展  

Negative Photosensitive Polyimide Materials and performance

作　　者：吴嘉豪 张诗洋 蔡铭威 王知 胡俊祺[1] 刘屹东 闵永刚 Wu Jiahao;Zhang Shiyang;Cai Mingwei;Wang Zhi;Hu Junqi;Liu Yidong;Min Yonggang(School of Materials and Energy,Guangdong University of Technology,Guangzhou,510006)

机构地区：[1]广东工业大学材料与能源学院,广州510006

出　　处：《化学通报》2023年第8期950-959,共10页Chemistry

基　　金：国家自然科学基金联合基金项目(U20A20340);国家重点研发计划项目(2020YFB0408100);广东引进创新创业团队计划项目(2016ZT06C412);佛山市科技创新团队项目(1920001000108);广州市红棉计划项目(HMJH-2020-0012)资助。

摘　　要：芳香族聚酰亚胺具有优异的绝缘性、热稳定性、介电性能、机械性能以及化学稳定性,可在微电子工业中用作绝缘和保护材料。负性光敏聚酰亚胺具有芳香族聚酰亚胺的优点,同时也具有感光性,使得微电子加工过程中减少对光刻胶的依赖,简化图案形成的工艺,有力促进了生产效率。本文综述了负性光敏聚酰亚胺的发展,重点介绍聚酰亚胺光刻胶体系的原理及近期研究进展,并对负性光敏聚酰亚胺的发展给予展望。Aromatic polyimides can be used as insulating and protective materials in the microelectronics industry due to the excellent insulating properties,thermal stability,dielectric properties,mechanical properties,and chemical stability.Negative photosensitive polyimide has the advantages of aromatic polyimide and additional photosensitivity,which reduces the dependence on photoresist during microelectronic processing.The process of pattern formation is simplified,thereby strongly promoting production efficiency.In this paper,the development of negative photosensitive polyimide is introduced,and the principle and recent research progress of polyimide photoresist system are expounded emphatically.Finally,the development prospect of negative photosensitive polyimide materials is forecasted.

关 键 词：负性光敏聚酰亚胺 绝缘材料 光刻胶 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]