BGA几何建模对仿真分析结果的影响研究  

Study on the Influence of BGA Solder Joint Modeling on Finite Element Simulation

作　　者：葛光亚 胡彦平[1] 陈津虎[1] 马思鹏 GE Guangya;HU Yanping;CHEN Jinhu;MA Sipeng(Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所,北京100076

出　　处：《强度与环境》2023年第4期8-14,共7页Structure & Environment Engineering

摘　　要：有限元分析是研究BGA封装焊点可靠性以及疲劳寿命的主要手段,由于焊点密集,通常需要通过简化模型进行计算。本文分别以球形、柱状及混合型三种焊点形状建立了含有BGA封装的电路板有限元模型,对比分析了三种焊点模型下含BGA封装的电路板的模态特性、随机振动响应、疲劳寿命计算结果,结果表明柱状焊点可有效提高计算效率,球状焊点最接近真实情况,混合型焊点具有代替球形焊点的可行性。Finite element analysis is the main method to study the reliability and fatigue life of BGA solder joints.Due to the high density of solder joints,it is usually necessary to simplify the model for calculation.In this paper,three finite element models of spherical,columnar,and mixed-type were established,The modal characteristics,random vibration response and fatigue life calculation results of BGA encapsulated circuit boards under three solder joint models were compared and analyzed.The results show that,The columnar solder joints can effectively improve the calculation efficiency,spherical solder joints are closest to the real situation,mixed-type solder joints is feasible to replace spherical solder joints.

关 键 词：BGA焊点 有限元分析 随机振动 疲劳寿命 

分 类 号：V416.3[航空宇航科学与技术—航空宇航推进理论与工程]