铝硅合金熔体在多孔石墨中的浸渗动力学  

Infiltration Dynamics of Al-Si Alloy Melt in Porous Graphite Structure

作　　者：黄樟林 魏文赋[1] 贾千喜 李箫波 杨泽锋 吴广宁[1] HUANG Zhanglin;WEI Wenfu;JIA Qianxi;LI Xiaobo;YANG Zefeng;WU Guangning(School of Electrical Engineering,Southwest Jiaotong University,Chengdu 611756,China;Guojia Electrical Engineering Co.,Ltd.,Chengdu 611730,China)

机构地区：[1]西南交通大学电气工程学院,成都611756 [2]国佳电气工程有限公司,成都611730

出　　处：《高电压技术》2023年第7期2868-2874,共7页High Voltage Engineering

基　　金：国家自然科学基金(52077182,51837009)。

摘　　要：石墨/铝复合材料因其独特的高温稳定性在轨道交通等领域具有重要应用价值。由于石墨、铝熔体的物理属性差异,需要利用压力浸渍法驱动铝熔体进入石墨基体孔隙、以提高复合材料的机械强度与导电性。铝熔体的浸渗动力学过程对复合材料的最终性能具有关键影响作用,其高度依赖于石墨相和铝相之间的界面润湿性。文中基于实验测试和数值模拟,系统研究了硅的体积分数对铝硅熔体在多孔石墨结构中浸渗动力学的影响。结果表明,添加硅元素能有效促进铝熔体的渗透,在较短的填充时间内获得高的填充率。由于局部孔隙残余气体作用,硅元素对合金熔体浸渗的促进作用存在极限。同时,论文对铝硅合金熔体在多孔石墨结构中渗流过程中的压力场、速度场进行了分析,并重点对复合材料的电导率进行了讨论。Graphite/aluminum composites have important applications in rail transportation and other fields because of the unique high-temperature stability.Due to the difference in physical properties of graphite and aluminum melt,the high gas pressure environment is required to drive the aluminum melt into the porosity of graphite matrix to improve the mechanical strength and electrical conductivity of the composite.The infiltration dynamics of aluminum melt,which highly depends on the interfacial wettability between graphite phase and aluminum phase,will has a significant effect on the final composite’s performance.Consequently,on the basis of experiments and numerical simulations,we studied the effect of silicon volume fraction on the infiltration dynamics of aluminum melt into the porous graphite matrix.Results show that adding silicon will effectively promote the infiltration of aluminum-silicon(Al-Si)alloy melt,achieving a higher filling rate with a shorter filling time.However,the promotion effects of adding silicon will come to its limit due to the effects of local pore residual gas.Meanwhile,the pressure and velocity fields during the infiltration of Al-Si alloy melt in a porous graphite structure are described in detail and the conductivity of the composites is discussed.

关 键 词：铝硅合金 多孔石墨结构 有限元 浸渗 电导率 

分 类 号：TB333[一般工业技术—材料科学与工程]