相控阵雷达T/R模块封装复合材料现状及发展趋势  

Research status and development trend of composite materials for phased array radar T/R module packaging

作　　者：程东锋 胡晓宇 周达 邱得超 樊思燕 何鹏[3] 牛济泰[1,2,3] CHENG Dongfeng;HU Xiaoyu;ZHOU Da;QIU Dechao;FAN Siyan;HE Peng;NIU Jitai(School of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,China;Henan Province Structural Functional Metal Matrix Composite Engineering Technology Research Center,Jiaozuo 454000,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]河南理工大学材料科学与工程学院,焦作454000 [2]河南省结构功能性金属基复合材料工程技术研究中心,焦作454000 [3]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《复合材料学报》2023年第8期4440-4459,共20页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金(51245008);河南省科技攻关项目(222102220006);河南省高等学校重点科研项目计划(22B430016);河南理工大学博士基金(B2019-38)。

摘　　要：随着航空航天、军工、电子技术的迅猛发展,封装方式与封装材料已成为电子设备进一步实现小型化、轻量化和高性能的重要制约。相控阵雷达T/R模块封装材料经历了从第一代的可伐合金到第二代的铜钨合金及近些年来兴起的以铝为基体的第三代轻质材料-碳化硅颗粒增强铝基复合材料和高硅铝合金,而二者的制备和加工技术仍存在的问题成为限制第三代材料全面推广和应用的重要瓶颈。本文综述了新一代封装材料的制备方法、机械加工性能、焊接工艺及表面处理等,详细介绍了新一代相控阵雷达T/R模块封装复合材料加工和应用的研究技术现状,并对其发展趋势进行展望。With the rapid development of aerospace,military,and electronic technologies,packaging methods and packaging materials have become important constraints for electronic devices to further achieve miniaturization,lightweight,and high performance.Phased array radar T/R module packaging materials have experienced from the first generation of Kovar alloy to the second generation of copper-tungsten alloy,and the emergence of the third generation of lightweight materials with aluminum as the matrix in recent years-silicon carbide particle reinforced aluminum matrix composite material and high silicon aluminum alloy,and the problems in the preparation and processing technology of the two have become an important bottleneck restricting the comprehensive promotion and application of the third generation of materials.In this paper,the preparation methods,machining properties,welding processes,and surface treatment of the new generation of packaging materials are reviewed,and the research technology status of the processing and application of the new generation of phased array radar T/R module packaging composites is introduced in detail,and its development trend prospects.

关 键 词：T/R模块 电子封装 SIC颗粒增强 铝基复合材料 高硅铝 制备加工 

分 类 号：TB331[一般工业技术—材料科学与工程]