基于计算机辅助技术的导电胶粘接效能与粘接强度分析评估  

Analysis and evaluation of bonding efficiency and bonding strength of conductive adhesives based on computer-aided technology

作　　者：周振华[1] ZHOU Zhenhua(Xi’an International University,Xi’an 710077,China)

机构地区：[1]西安外事学院,陕西西安710077

出　　处：《粘接》2023年第9期31-34,共4页Adhesion

摘　　要：导电胶的粘接效能如粘接强度、粘接后导电性等可以直接决定电子组装的最终效果。针对当前导电胶粘接效能分析与计算工程量过大、计算效果不够精准等问题,借助灰色关联分析方法构建了一种计算机辅助分析导电胶粘接效能的模型,对该导电胶的粘结效能进行分析,旨在得到控制导电胶粘接效能的方法,以便更好地制备导电胶材料及应用导电胶材料进行电子元器件的粘接等。结果表明:该模型能够准确得到导电胶的粘接效能分析结果,可以帮助导电胶制备环节工作人员降低工作强度。The bonding efficiency of conductive adhesive,such as bonding strength and post-bonding conductivity,can directly determine the final effect of electronic assembly.In this paper,a computer aided model for analyzing the bonding efficiency of conductive adhesives is established by using grey correlation analysis method to solve the problems such as the large amount of engineering work and the inaccurate calculation results.The bonding efficiency of the conductive adhesive was analyzed to get a method to control the bonding efficiency of conductive adhesive so as to better prepare conductive adhesive materials and apply conductive adhesive materials to the bonding of electronic components.The results show that the model can accurately obtain the analysis results of the bonding efficiency of the conductive adhesive,which can help the staff to reduce the working intensity of the conductive adhesive preparation.

关 键 词：导电胶 粘接效能 灰色关联分析 计算机辅助工具 

分 类 号：TQ433.437[化学工程] TP391[自动化与计算机技术—计算机应用技术]