不同锡膏量对QFP焊点热循环的可靠性分析  

Reliability Analysis of Thermal Cycle of QFP Solder Joint with Different Solder Paste Amounts

作　　者：江颖 丁晓杰 郭啸峰 JIANG Ying;DING Xiaojie;GUO Xiaofeng(The 16th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第十六研究所,合肥230088

出　　处：《电子工艺技术》2023年第5期15-19,共5页Electronics Process Technology

基　　金：中国科学院国家天文台“GRAS-4X波段高频接收机”项目(61160020190009MDD)。

摘　　要：在SMT制程中,钢网模板开口尺寸决定了锡膏量的多少,而锡膏量对最终焊点的形态和连接质量有最直接的影响。以锡膏量为研究对象,用有限元分析方法对QFP引脚的三种不同钢网模板开口尺寸(对应不同锡膏量)所焊接的QFP焊点进行仿真,在施加温度循环载荷的情况下,比较这三种锡膏量所焊接焊点的可靠性,最终得出最优化的QFP引脚模板开口尺寸并应用到产品中,再通过试验验证仿真的正确性,研究结果为QFP器件在SMT焊接中钢网模板开口尺寸设计提供了理论指导。In SMT process,the opening size of steel mesh template determines the volume of solder paste,and the amount of solder paste has the most direct impact on the shape and connection quality of the final solder joint.Taking the solder paste amount as the research object,the QFP solder joints soldered by three different mesh template opening sizes(corresponding to different solder paste amounts)of QFP leads are simulated by finite element analysis method.Under the condition of applying temperature cyclic load,the reliability of the solder joints soldered by these three solder paste amounts is compared.Finally,the optimized QFP leads template opening size is obtained and applied to the product.Then the correctness of the simulation is verified by experiments.The research results provide theoretical guidance for the design of mesh template opening size of QFP devices in SMT soldering.

关 键 词：QFP 钢网开口尺寸 有限元分析 温度循环载荷 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]