细晶氧化铝陶瓷基板的流延成型和显微结构控制研究  

Tape Casting and Microstructure Controlling of Fine Grained Al_(2)O_(3) Ceramic Substrate

作　　者：邓佳威 熊新锐 徐协文 刘鹏 杨现锋 谢志鹏 DENG Jiawei;XIONG Xinrui;XU Xiewen;LIU Peng;YANG Xianfeng;XIE Zhipeng(School of Materials Science and Engineering,Changsha University of Science&Technology,Changsha 410004,China;State Key Laboratory of New Ceramic and Fine Processing,School of Materials Science and Engineering,Tsinghua University,Beijing 100083,China)

机构地区：[1]长沙理工大学材料科学与工程学院,长沙410004 [2]清华大学材料学院新型陶瓷与精细工艺国家重点实验室,北京100083

出　　处：《硅酸盐通报》2023年第9期3306-3314,共9页Bulletin of the Chinese Ceramic Society

基　　金：国家自然科学基金(52172063);江西省重点研发计划(20232BBE50029)。

摘　　要：采用砂磨工艺获得了亚微米氧化铝复合粉体,用于制备微晶氧化铝陶瓷基板,研究了浆料组成对浆料流变学性质、生坯密度、生坯应力-应变行为的影响,以及烧结制度对平均晶粒尺寸和基板抗弯强度的影响。结果表明,固相含量、R值(增塑剂和黏结剂的质量比)和分散剂用量等关键因素决定了流延浆料的流变学性质。R值增大导致生坯强度和密度降低,提高固相含量有利于增加最大可流延厚度,优化工艺条件下可制备0.16~1.20 mm的坯片。当烧结温度为1550℃、升温速率为2.5℃/min、保温时间为60 min时,制备的陶瓷基板平均晶粒尺寸为1.1μm左右,晶粒尺寸分布均匀,抗弯强度达到(440±25)MPa。The submicron Al_(2)O_(3) composite powder was obtained by sand milling process,which was used to prepare fine grained Al_(2)O_(3) ceramic substrates.The effect of slurry composition on rheological properties of slurry,bulk density and stress-strain behavior of green tape was investigated,and the influence of sintering schedule on average grain size and flexural strength of ceramic substrate was also studied.The results show that key factors such as solid content,R value(mass ratio of plasticizer to binder)and dispersant dosage determine the rheological properties of slurry.The increase of R value leads to the reduction of tensile strength and density of green tape,and the increase of solid content is beneficial to increase the possible maximum casting thickness.Under the optimized process conditions,0.16~1.20 mm green sheets can be prepared.At a sintering temperature of 1550℃,a heating rate of 2.5℃/min and a holding time of 60 min,the average grain size of the prepared ceramic substrate is about 1.1μm,the grain size distribution is uniform,and the flexural strength reaches(440±25)MPa.

关 键 词：氧化铝 陶瓷基板 流延成型 晶粒尺寸 烧结制度 

分 类 号：TQ174[化学工程—陶瓷工业]