化学气相沉积石墨烯/铜合金制备与导电、耐磨性能研究  

Preparation,Conductivity and Wear Resistance of Graphene/Copper Alloy by Chemical Vapor Deposition

作　　者：戴丹 杨科[1,2,3,4] 叶辰 虞锦洪[1,2,3,4] 邓丽芬 李惠敏[5] 江南 林正得[1,2,3,4] DAI Dan;YANG Ke;YE Chen;YU Jinhong;DENG Lifen;LI Huimin;JIANG Nan;LIN Zhengde(Key Laboratory of Marine Materials and Related Technologies,Zhejiang Key Laboratory of Marine Materials and Protective Technologies,Ningbo Institute of Materials Technology and Engineering(NIMTE),Chinese Academy of Sciences,Ningbo 315201,China;College of Chemical Engineering,Zhejiang University of Technology,Hang-zhou 310014,China;Hangzhouwan Institute,Ningbo Institute of Materials Technology and Engineering(NIM-TE),Chinese Academy of Sciences,Ningbo 315336,China;Center of Materials Science and Optoelectronics En-gineering,University of Chinese Academy of Sciences,Beijing 100049,China;China Tungsten Alloy Technology(Putian)Co.,Ltd,Putian 351254,China)

机构地区：[1]中国科学院宁波材料技术与工程研究所,中国科学院海洋新材料与应用技术重点实验室,浙江省海洋与防护重点实验室,浙江宁波315201 [2]浙江工业大学化学工程学院,浙江杭州310014 [3]中国科学院宁波材料所杭州湾研究院,浙江宁波315336 [4]中国科学院大学材料科学与光电技术学院,北京100049 [5]中钨合金科技(莆田)有限公司,福建莆田351254

出　　处：《铜业工程》2023年第4期78-84,共7页Copper Engineering

基　　金：STS计划配套院市合作项目(2020HJSTS010);国家重点研发计划项目(2022YFB3706602)资助。

摘　　要：通过原位化学气相沉积(CVD)技术,在铜粉上包覆石墨烯,再通过真空热压技术制备出石墨烯/铜合金。研究表明:铜晶粒表面包覆了高质量的石墨烯。在铜粉表面原位生长的石墨烯均匀分散在铜晶粒的晶界处,而且石墨烯的含量低,只占0.04%(质量分数)。石墨烯/铜合金具有高的导电性能,导电率高达97%IACS。同时,石墨烯/铜合金的摩擦系数降低到0.46,与铜相比降低了38.7%。石墨烯/铜合金的磨损率降低到2.09×10^(-4)mm^(3)/(N·m),与铜相比降低了68.6%。Copper powder was coated with graphene by in situ chemical vapor deposition(CVD),and graphene/copper alloy was formed by vacuum hot pressing technology.The results showed that the surface of copper grain was coated with high quality graphene.The graphene grown on the surface of copper powder is evenly dispersed in the grain boundaries of copper grains.And the content of graphene was low,only 0.04%(mass fraction).Graphene/copper alloys had high electrical conductivity,up to 97%IACS.At the same time,the friction coefficient of graphene/copper alloy was reduced to 0.46,which was 38.7%lower than that of copper.The wear rate of graphene/copper alloy was reduced to 2.09×10^(-4) mm^(3)/(N•m),which was 68.6%lower than that of copper.

关 键 词：石墨烯/铜 化学气相沉积 原位 导电性 耐磨性 

分 类 号：TG135.6[一般工业技术—材料科学与工程]