钼酸钠-HEC-SPS复合添加剂对电解铜箔粗化效果的影响  

Effect of a composite additive comprising sodium molybdate, HEC, and SPS on roughening of electrolytic copper foil

作　　者：彭雪嵩 由宏伟 李兰晨 宋姝嬛 乐士儒 张锦秋 杨培霞 安茂忠 PENG Xuesong;YOU Hongwei;LI Lanchen;SONG Shuhuan;LE Shiru;ZHANG Jinqiu;YANG Peixia;AN Maozhong(School of Chemical Engineering and Chemistry,Harbin Institute of Technology,Harbin 150000,China)

机构地区：[1]哈尔滨工业大学化工与化学学院,黑龙江哈尔滨150000

出　　处：《电镀与涂饰》2023年第17期56-67,共12页Electroplating & Finishing

基　　金：国家重点研发项目(2021YFB3400800)

摘　　要：为了提高电解铜箔的剥离强度,先研究了单独添加钼酸钠、羟乙基纤维素(HEC)和聚二硫二丙烷磺酸钠(SPS)对铜箔粗化效果的影响,再通过正交试验对3种添加剂进行复配,得到较佳的复合添加剂──50 mg/L钼酸钠+5 mg/L SPS+3 mg/L HEC。采用该复合添加剂时,铜箔在电流密度25 A/dm^(2)、温度35℃的条件下粗化1次,再固化2次后毛面粗糙度(Rz)为7.57μm,剥离强度为1.53 N/mm,劣化率为0。The effects of different additives i.e.sodium molybdate,hydroxyethyl cellulose(HEC),and bis-(sodium sulfopropyl)-disulfide(SPS)on the roughening of electrolytic copper foil were studied to improve its peeling strength.A composite additive comprising 50 mg/L sodium molybdate,5 mg/L SPS,and 3 mg/L HEC was determined by orthogonal test.After roughening in the electrolyte containing the optimized composite additive at current density 25 A/dm^(2) and temperature 35℃once followed by curing twice,the surface roughness(Rz)at matte side of the electrolytic copper foil was 7.57μm.The copper foil featured a peeling strength of 1.53 N/mm and a zero degradation rate.

关 键 词：电解铜箔 添加剂 粗化 剥离强度 粗糙度 

分 类 号：TQ153.14[化学工程—电化学工业]