等离子体技术制备高阻隔薄膜作用方式和应用现状(二)  

Research Progress in Preparation of Barrier Film by Plasma Technology(Ⅱ)

作　　者：刘忠伟[1] 杨丽珍[1] 桑利军[1] 王正铎[1] 张海宝[1] 程久珊 刘博文 陈强[1] LIU Zhongwei;YANG Lizhen;SANG Lijun;WANG Zhengduo;ZHANG Haibao;CHENG Jiushan;LIU Bowen;CHEN Qiang(Laboratory of Plasma Physics and Materials,Beijing Institute of Graphic Communication,Beijing102600,China)

机构地区：[1]北京印刷学院等离子体物理及材料研究室,北京102600

出　　处：《真空与低温》2023年第5期425-438,共14页Vacuum and Cryogenics

基　　金：国家自然科学基金(12075032);北京市自然科学基金(8222055、2232061);云南省刑事科学技术重点实验室开放课题(YJKF002);北京印刷学院项目(Ec202207、S202210015021)。

摘　　要：近年来,在食品和药品包装、可穿戴有机电子封装、有机发光二极管(OLED)和量子点封装、真空绝缘板密封、生物医学和可再生能源防护等方面,以柔性塑料为基体的阻湿、阻氧、高透明的薄膜得到了广泛的应用,促进了阻隔膜制备技术的发展。等离子体技术在阻隔膜制备中显示出独特的优势,包括:可以大规模生产制备阻隔膜、薄膜性能优异、产品成本低廉等。这些等离子体技术包括等离子体增强物理气相沉积(PEPVD)、等离子体增强/辅助化学气相沉积(PECVD/PACVD)和等离子体增强/辅助原子层沉积(PEALD/PAALD)技术等。综述了基于等离子体技术制备阻隔膜的方法和理论,主要介绍等离子体源、等离子体作用方式、等离子体诊断和等离子体增强沉积阻隔膜的生长机制,以阐明等离子体参数和阻隔膜制备及性能之间的内在联系,为阻隔薄膜乃至类似柔性功能材料的制备和应用提出指导性建议。Over the past several decades,the moisture and gas barrier films on the flexible plastic substrates have been widely used in various fields,such as s food packaging,encapsulation of organic electronics,organic light-emitting diodes(OLED),sealing of vacuum insulation panels,biomedical applications,and renewable organic energy.The technique of plasma has demonstrated unique characteristic and advantages to fabricate the barrier films,including the low cost and easy to scale-up.A plasma technique commonly used for prepare barrier films are plasma enhanced physical vapor deposition(PEPVD),plasma-assisted/enhanced chemical vapor deposition(PACVD/PECVD),and plasma-assisted/enhanced atomic layer deposition(PAALD/PEALD).This work mainly focus on the fabrication of barrier films via plasma-based technology.The effects of the plasma source and plasma working environment on barrier films growth will be summarized,and mechanism of plasma-enhanced film growth in PVD,PECVD or PEALD will be discussed.

关 键 词：等离子体 特性和诊断 阻隔膜 结构表征和性能测量 柔性聚合物 

分 类 号：TG174.444[金属学及工艺—金属表面处理] O4848[金属学及工艺—金属学]