芯片级多轴集成微陀螺方案对比与发展趋势分析  

Comparison and development trend analysis of chip level multi axis integrated MEMS gyroscope

作　　者：魏雯强 鲁征浩[2] 陈方[3] 申冲[1] 石云波[1] 曹慧亮[1] WEI Wenqiang;LU Zhenghao;CHEN Fang;SHEN Chong;SHI Yunbo;CAO Huiliang(Key Laboratory of Instrument Science and Dynamic Testing,North University of China,Taiyuan 030051,China;Micro-Nano Sensor Technology Research Center,Soochow University,Suzhou 215006,China;State Key Laboratory of Transducer Technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China)

机构地区：[1]中北大学仪器科学与动态测试教育部重点实验室,太原030051 [2]苏州大学微纳传感技术研究中心,苏州215006 [3]中科院上海微系统与信息技术研究所传感技术国家重点实验室,上海200050

出　　处：《中国惯性技术学报》2023年第9期932-939,954,共9页Journal of Chinese Inertial Technology

基　　金：国家重点研发计划(2022YFB3205000);国家自然科学基金(U2230206);国家基础加强计划技术领域基金(021-JCJQ-JJ-0315);装备发展部预研领域基金(80917010501)。

摘　　要：微机械陀螺仪作为检测载体角速率信息的器件,在姿态控制平台和惯性导航领域有着广泛应用。首先结合国内外发展动态及研究成果,分析了三类芯片级多轴集成微机械陀螺集成方法:三单轴陀螺正交集成法、单片单结构三轴陀螺法及单片多结构陀螺阵列法。其次,通过对当前方案的总结与分析,比较了各方案的优缺点,设计了一种频差小、抗冲击能力强的单片三轴轮环式陀螺结构。仿真实验表明该结构能承受20000 g冲击,轮结构频差为180.3 Hz,环结构频差为3 Hz。最后,分析了未来芯片级多轴集成微陀螺仪的改良方向。As a device to detect the angular rate of the carrier,MEMS gyroscope is widely used in the field of attitude control platform and inertial navigation.Firstly,based on the development trends and research achievements at home and abroad,three integration methods of multi-axis MEMS gyroscopes are introduced in detail,including orthogonal placement method of three-axis gyroscopes,monolithic single-structure three-axis gyroscopes and monolithic multi-structure gyro array method.Secondly,by summarizing and analyzing the current schemes,the advantages and disadvantages of the three methods are compared,and a single chip three-axis wheel ring gyroscope structure with small frequency difference and strong impact resistance is designed.The simulation results show that the structure can withstand 20000 g shock,the frequency split of wheel structure is 180.3 Hz,and the frequency split of ring structure is 3 Hz.Finally,the improvement direction of future chip level multi-axis integrated MEMS gyroscopes is analyzed.

关 键 词：微机械陀螺仪 敏感结构 单结构三轴 正交集成 陀螺阵列 

分 类 号：TH89[机械工程—仪器科学与技术]