曝光时不同载具对光敏玻璃通孔工艺的影响  

Effect of Different Carriers During Exposure Process on the Through-Glass Via Formation Process of Photosensitive Glass

作　　者：刘书利 叶刚 李奇哲 夏晨辉 LIU Shu-li;YE Gang;LI Qi-zhe;XIA Chen-hui(Theth Research Institute of CETC)

机构地区：[1]中国电子科技集团公司第五十八研究所

出　　处：《中国集成电路》2023年第8期65-69,共5页China lntegrated Circuit

摘　　要：基于光敏玻璃,采用紫外光曝光、热处理以及湿法刻蚀方法制备出玻璃通孔,研究了曝光过程中不同反射率载具对玻璃通孔工艺的影响,揭示了光敏玻璃曝光时的改性过程。实验结果表明,曝光量相同时,反射率高的载具有益于玻璃通孔的制备。Based on photosensitive glass,the through-glass via(TGV)was obtained by using UV exposure,heat treatment and wet etching.The effect of carriers with different reflectivity during exposure process on the formation of TGV was studied,and modification process of photosensitive glass during exposure was revealed.The experimental results showed that when the exposure amount was the same,the carrier with high reflectivity was beneficial to the formation of TGV.

关 键 词：光敏玻璃 玻璃通孔 载具 改性过程 

分 类 号：TQ171.7[化学工程—玻璃工业] TN405[化学工程—硅酸盐工业]