基于薄膜传感器的化学机械抛光面压力分布检测装置研制及应用  

Development and Application of Chemical Mechanical Polishing Surface-Pressure Distribution Detection Device Based on Thin-Film Sensors

作　　者：张楚鹏 杨林霄 许涵 孙家政 李莹雪 陈肖 Zhang Chupeng;Yang Linxiao;Xu Han;Sun Jiazheng;Li Yingxue;Chen Xiao(College of Mechanical Engineering,Hubei University of Technology,Wuhan 430068,Hubei,China;College of Locomotive and Rolling Stock Engineering,Dalian Jiaotong University,Dalian 116028,Liaoning,China)

机构地区：[1]湖北工业大学机械工程学院,湖北武汉430068 [2]大连交通大学机车车辆工程学院,辽宁大连116028

出　　处：《激光与光电子学进展》2023年第15期184-192,共9页Laser & Optoelectronics Progress

基　　金：国家自然科学基金(51905159);辽宁省博士科研启动基金计划项目(2019-BS-040);湖北省重点实验室开放基金(KFJJ-2022006)。

摘　　要：光学元件化学机械抛光(CMP)过程中元件与抛光垫之间接触压力分布是影响元件抛光去除效率和抛光效果的关键因素,但因元件、磨料、抛光垫之间的接触状态较复杂、且不停变化,难以通过仿真计算获得。为了研究确定性抛光去除机理,设计了一套CMP面压力分布在位实时检测装置,将薄膜压阻传感器阵列式布置于抛光垫下,对元件与抛光垫接触面的压力分布展开实时检测,并通过仿真分析抛光垫与元件表面接触压力分布理论模型,与实测结果进行对比。基于自主搭建的实验平台,模拟工况进行研磨实验,并使用基恩士CL-3000激光位移传感器测量抛光垫面形。实验结果表明:随着研磨时间增加,抛光垫面形逐渐平整并接近当前研磨条件下的极限,其标准差由0.2079 mm降低为0.1839 mm,使用压力分布检测装置测得区域压力值标准差第一阶段下降8.2%,第二阶段下降0.2%,工件与抛光垫接触面压力分布逐渐均匀,与抛光垫面形逐渐平整的趋势相对应,证明该装置可以有效检测抛光过程中的压力分布及实时变化。The contact pressure distribution between components and polishing pads during the chemical mechanical polishing(CMP)of optical components is a critical factor that influences the polishing removal efficiency and polishing effect of components.However,it is difficult to obtain through simulations because the contact state between components,abrasives,and polishing pads is complex and changes continuously.In this study,a set of CMP surface-pressure distribution in-situ real-time detection devices is designed,and the thin-film piezoresistive sensors are arranged under the polishing pad in an array to detect the pressure distribution on the contact surface between the component and polishing pad in real time.Moreover,the theoretical model of the contact pressure distribution between the polishing pad and component surface is analyzed using simulations and compared with the experimental measurement results.Based on the experimental platform built independently,grinding experiments are conducted,and the surface shape of the polishing pad is measured using a Keyence CL-3000 laser displacement sensor.The experimental results show that with an increase in grinding time,the shape of the polishing pad surface gradually becomes flat and is close to the limit of the current grinding conditions.Its standard deviation decreases from 0.2079 to 0.1839 mm.The standard deviation of the regional pressure value measured using the pressure distribution detection device decreases by 8.2% and 0.2% in the first and second stages,respectively.The pressure distribution on the contact surface of the workpiece and polishing pad gradually become uniform,which corresponds to the trend of gradual flattening of the polishing pad surface.This study demonstrates that the proposed device can effectively detect pressure distribution and real-time changes during the polishing process.

关 键 词：化学机械抛光 接触面压力分布 薄膜压阻传感器 在位实时测量系统 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]