基于红外热成像的传感器电路板缺陷检测方法  

Defect Detection Method of Sensor Circuit Board Based on Infrared Thermal Imaging

作　　者：史洪玮[1,2] 许崇彩 SHI Hongwei;XU Chongcai(School of Information Engineering,Suqian University,Suqian Jiangsu 223800,China;Industrial Technology Research Institute,Suqian University,Suqian Jiangsu 223800,China)

机构地区：[1]宿迁学院信息工程学院,江苏宿迁223800 [2]宿迁学院产业技术研究院,江苏宿迁223800

出　　处：《传感技术学报》2023年第8期1261-1267,共7页Chinese Journal of Sensors and Actuators

基　　金：2020年江苏高校自然科学研究面上项目(20KJB510042);2020宿迁市项目新冠肺炎“CT+AI”辅助诊断系统关键技术研究项目(Z2020133)。

摘　　要：当传感器电路板出现缺陷时,其缺陷位置处的温度会发生明显变化,通过这一特性可以对传感器电路板的缺陷进行有效检测,因此提出基于红外热成像的传感器电路板缺陷检测方法。以红外热成像技术为基础,采用红外摄像仪采集传感器电路板的缺陷图像,并利用非线性拟合法和奇异值分解法对图像进行非线性拟合校正和增强预处理。将预处理后的图像输入到SVM诊断模型中,输出所有检测模式的加权基本概率分配值。利用证据理论对加权基本概率分配值进行融合处理,输出电路板缺陷检测结果,完成传感器电路板缺陷检测。实验结果表明,所提方法对电路板缺陷图像的增强效果较好,并且缺陷检测结果与实际结果一致。因此,说明所提出方法能够提高传感器电路板缺陷检测的性能。When there is a defect on the sensor circuit board,the temperature at the defect position will change obviously.According to this characteristic,the defect of the sensor circuit board can be effectively detected.Therefore,a defect detection method of the sensor circuit board based on infrared thermal imaging is proposed.According to the infrared thermal imaging technology,the infrared camera is used to collect the defect image of the sensor circuit board,and the nonlinear fitting method and singular value decomposition method are used to correct and enhance the image.The preprocessed image is input into the SVM diagnosis model,and the weighted basic prob⁃ability assignment values of all detection modes are output.Based on the evidence theory,the weighted basic probability distribution val⁃ue is fused,and the circuit board defect detection result is output to complete the sensor circuit board defect detection.The experimental results show that the proposed method can enhance the defect image of circuit board better,and the defect detection results are consist⁃ent with the actual results.Therefore,the proposed method can improve the performance of defect detection of sensor circuit board.

关 键 词：传感器电路板 缺陷检测 红外热成像 奇异值分解 

分 类 号：TN219[电子电信—物理电子学]