化学机械抛光垫在集成电路制造中的专利技术分析  

Analysis of patented technology of chemical mechanical polishingpad in integrated circuit manufacturing

作　　者：王海[1] 周文[1] 史巍[1] WANG Hai;ZHOU Wen;SHI Wei(Patent Examination Cooperation(Beijing)Center of the Patent Office,CNIPA,Beijing 100160)

机构地区：[1]国家知识产权局专利局专利审查协作北京中心,北京100160

出　　处：《首都师范大学学报（自然科学版）》2023年第5期52-61,共10页Journal of Capital Normal University：Natural Science Edition

摘　　要：通过对美国罗门哈斯公司1997—2020年在抛光垫领域的专利申请进行分析,得到其全球专利申请量分布和申请趋势、专利转让情况、专利法律状态、专利布局区域、专利引用状况以及技术发展脉络等重要信息。确定了该公司从1909年至今在该领域中的研发历程和研发重点方向,为我国企业在该领域的发展和突破,以及在技术和区域方面的专利布局提供一定的参考,促进我国在化学机械抛光垫领域中的健康发展。By analyzing the patent applications of American Rohm and Haas in the polishing pad field from 1997 to 2020,we can obtain important information such as the distribution and trend of its global patent applications,patent transfer situation,patent legal status,patent layout area,patent citation status,and technology development context.It has determined the technical route and focus in this field since 1909,providing certain reference for the development and breakthrough of Chinese enterprises in this field,as well as the patent layout in technical and regional aspects,and promoting the healthy development of China in the field of chemical mechanical polishing pad.

关 键 词：化学机械抛光 抛光垫 专利分析 技术路线 

分 类 号：TN305.2[电子电信—物理电子学]