氰酸酯-双马-碳氢复合树脂体系固化反应动力学及性能  

Curing reaction kinetics and properties of cyanate ester-bismaleimide-hydrocarbon composite resin system

作　　者：殷卫峰 许永静[2] 曾耀德 张济明 刘锐 霍翠 颜善银[2] YIN Weifeng;XU Yongjing;ZENG Yaode;ZHANG Jiming;LIU Rui;HUO Cui;YAN Shanyin(Shaanxi Sub-centers of National Engineering Research Center of Electronic Circuits Base Materials,Shaanxi Shengyi Technology Co.,Ltd.,Xianyang 712000,China;National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.,Dongguan 523808,China)

机构地区：[1]陕西生益科技有限公司国家电子电路基材研究中心陕西分中心,陕西咸阳712000 [2]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《绝缘材料》2023年第10期37-42,共6页Insulating Materials

基　　金：科技部创新方法工作专项基金(2019IM010203)。

摘　　要：本研究将碳氢(CH)树脂引入氰酸酯-双马(BT)树脂体系制备了氰酸酯-双马-碳氢(BT-CH)复合树脂体系及BT-CH覆铜箔层压板。利用差示扫描热量法(DSC)、傅里叶红外光谱(FTIR)、扫描电镜(SEM)研究了BT-CH复合树脂体系的固化反应动力学参数,考察了固化后BT-CH复合树脂体系的介电损耗(Df)以及热氧老化性能。结果表明:BT-CH复合树脂体系的反应级数、活化能、频率因子小于BT体系,CH树脂对BT树脂的固化反应有促进作用。BT-CH覆铜箔层压板的红外光谱中,氰酸酯基团、酰亚胺基团、乙烯基集团特征峰消失或减弱,三嗪环特征吸收峰出现,树脂体系反应充分。扫描电镜显示基板无空洞等微观缺陷。BT-CH基板的Df比BT基板提高了25%,其在153℃下热氧老化4周后Df增加6%,具有优异的耐热氧老化性能。In this research,cyanate ester-bismaleimide-hydrocarbon(BT-CH)composite resin system and BT-CH copper clad laminates(CCL)were prepared by introducing hydrocarbon(CH)resin into ester-bismaleimide(BT)resin system.The curing kinetic parameters of BT-CH composite resin system were studied by differential scanning calorimetry(DSC),Fourier infrared spectroscopy(FTIR),and scanning electron microscopy(SEM).The dielectric loss(Df)and thermal oxygen ageing properties of BT-CH composite resin were investigated after curing.The results show that the reaction order,activation energy,and frequency factors of BT-CH composite resin system are smaller than those of BT system,CH can promote the curing reaction of BT.According to the FTIR spectra of BT-CH CCL,the characteristic peaks of cyanate group,imide group,and vinyl group disappear or weaken,while that of triazine ring appear,the reaction of resin system is sufficient.SEM shows there is no hole or other microdefect in the BT-CH substrates.The Df of BT-CH substrate is 25%higher than that of BT substrate,and the Df of BT-CH substrate increases by 6%after thermal oxygen ageing at 153℃for 4 weeks,which has excellent thermal oxygen ageing resistance.

关 键 词：氰酸酯 双马来酰亚胺 碳氢树脂 介电性能 

分 类 号：TM215[一般工业技术—材料科学与工程]