氯化铜溶液的电化学伏安行为研究  

Study on Electrochemical Voltammetric Behavior of Copper Chloride Solution

作　　者：华艳会 张馨月 杨富钟 张武 HUA Yan-hui;ZHANG Xin-yue;YANG Fu-zhong;ZHANG Wu(Engineering Training Center,Shenyang Ligong University,Shenyang 110159,China;School of MaterialsScience and Engineering,Shenyan Ligong University,Shenyang 110159,China)

机构地区：[1]沈阳理工大学工程实践中心,辽宁沈阳110159 [2]沈阳理工大学材料科学与工程学院,辽宁沈阳110159

出　　处：《世界有色金属》2023年第13期202-204,共3页World Nonferrous Metals

摘　　要：铜电沉积在各个领域取得了十分广泛的应用,本文采用不同浓度的氯化铜溶液,利用旋转盘电极技术,对氯化铜溶液的电化学伏安行为进行了研究。实验结果表明,铜的电化学还原过程属于不可逆过程。铜离子在溶液中的扩散系数为10^(-5)cm~2/s数量级。新生成的金属铜与电极的附着力较强,旋转盘电极下的循环伏安曲线观察到了较强的电流。Electrochemical voltammetric behavior of copper chloride solution electrodeposition of copper has been widely used in various fields.The experimental results show that the electrochemical reduction of copper is an irreversible process.The diffusion coefficient of copper ion in solution is 10~(-5)cm~2/s.The newly formed metal copper has a strong adhesion to the electrode,and a strong current is observed in the cyclic voltammetry curve under the rotating disk electrode.

关 键 词：氯化铜 旋转盘电极 伏安行为 

分 类 号：G633.8[文化科学—教育学]