面向FC-BGA的增层胶膜封装基板镀铜工艺  

Cu deposition technologies for build-up film substrates towardsFC-BGA

作　　者：李鹏[1] 于均益 罗遂斌[1,2] 赖志强 肖彬 于淑会 孙蓉[1,2] Peng Li;Junyi Yu;Suibin Luo;Zhiqiang Lai;Bin Xiao;Shuhui Yu;Rong Sun(Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518103,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院深圳先进技术研究院,深圳先进电子材料国际创新研究院,深圳518103 [2]中国科学院大学,北京100049

出　　处：《中国科学：化学》2023年第10期1866-1879,共14页SCIENTIA SINICA Chimica

基　　金：国家自然科学基金资助项目(编号:U20A20255);先进电子封装材料国家地方联合工程实验室(2017-934);SIAT-CUHK高密度电子封装材料与器件联合实验室;广东省基础与应用基础研究基金(编号:2022A1515110066);广东省高密度电子封装关键材料实验室(项目号:2014B030301014);深圳市科创委基金项目(编号:JSGG20210802154540018,JSGG20210629144805017)。

摘　　要：近年来,基于增层胶膜材料,采用半加成法工艺生产制造窄线宽/线距电子线路的倒装芯片球栅阵列(FCBGA)封装基板的相关技术发展迅速.增层胶膜材料微观结构及其物理、化学性质、镀铜工艺参数和化学药水等多个因素共同决定线路精细度和结合力,并最终影响封装基板的品质和可靠性,其内在关联性值得关注和深入研究.本文基于FC-BGA增层胶膜封装基板的导电互连制造技术,重点探讨半加成法工艺所用化学药水的成分及作用,并结合镀铜的性能评价,提出未来进一步提高封装基板线路品质的发展方向.In recent years,technologies concerning flip chip ball grid array(FC-BGA)substrates with the circuitry of narrow line/space have witnessed significant developments,which are fabricated on build-up films(BFs)via the semiadditive process(SAP).A variety of factors including microstructures,physical and chemical features of build-up films,copper deposition parameters and relevant chemical bath compositions collectively determine the resolution and bonding strength of fabricated circuitry and ultimately affect the quality and reliability of packaging substrates,which makes it meaningful to study and reveal the relevance of these factors.Based on the fabrication technologies of copper interconnects in build-up film substrates towards FC-BGA,this review puts emphasis on the discussion of copper plating bath compositions in the semi-additive process on build-up films,and outlooks possible future prospects of further increasing the quality of circuitry,in accordance with some key evaluation factors of deposited copper.

关 键 词：封装基板 增层胶膜 倒装芯片球栅阵列 镀铜 半加成法 精细线路 

分 类 号：TN405[电子电信—微电子学与固体电子学]