芯片金属互连中电镀添加剂的理论与实验研究  

Theoretical and experimental research on electroplating additives inchip metal interconnects

作　　者：李亚强 李若鹏 江杰 杨培霞 张锦秋 刘安敏 Peter Broekmann 安茂忠 Yaqiang Li;Ruopeng Li;Jie Jiang;Peixia Yang;Jinqiu Zhang;Anmin Liu;Peter Broekmann;Maozhong An(School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin 150001,China;State Key Laboratory of Fine Chemicals,School of Chemical Engineering,Dalian University of Technology,Dalian 116000,China;Department of Chemistry,Biochemistry and Pharmaceutical Science,University of Bern,3012 Bern,Switzerland)

机构地区：[1]哈尔滨工业大学化工与化学学院,哈尔滨150001 [2]大连理工大学化工学院,大连116000 [3]伯尔尼大学化学、生物化学与药学系,伯尔尼3012

出　　处：《中国科学：化学》2023年第10期1970-1988,共19页SCIENTIA SINICA Chimica

基　　金：国家自然科学基金(21972037);城市水资源与水环境国家重点实验室(哈尔滨工业大学)(2021TS07)资助项目。

摘　　要：电镀技术是实现芯片制程中金属互连的核心技术,而电镀所用添加剂是实现高质量互连的关键.本文系统地概述了电镀互连中添加剂的研究方法.首先对添加剂的电化学研究方法进行介绍,将电化学研究法分为伏安与阻抗分析法、恒电流研究法和其他电化学方法三类,并对电化学方法的应用和缺点进行总结.随后,从分子动力学模拟和量子化学计算两方面介绍了理论计算在添加剂研究中的应用.最后,介绍了各种先进表征技术在研究添加剂机理方面的应用.从波谱分析方法、电子显微镜研究方法和二次离子质谱研究方法三个方面介绍了先进表征方法在研究添加剂作用机理的应用.总结添加剂研究的不同方法为后续开展添加剂的筛选及作用机理的研究提供指导.Electroplating technology is the key technology to achieve metal interconnects in chip fabrication,and adding proper additives into the electroplating bath is crucial to obtain high-quality interconnects.The research methods are systematically summarized in this work.Firstly,the electrochemical research methods are introduced and electrochemical methods are divided into three categories:voltammetry and impedance analysis,galvanostatic measurement analysis,other electrochemical methods.The application of these electrochemical methods and drawbacks are summarized.In the second part,the application of theoretical calculations in additive research is introduced from the aspects of molecular dynamics simulation(MD)and quantum chemical calculation(QC).In the final part,the application of various advanced characterization techniques is illustrated.The application of advanced characterization on studying additive mechanism is demonstrated from three aspects:spectral research methods,electron microscopy methods and secondary ion-mass spectrometry methods.Summarizing different research methods for electroplating additives can provide the guidance for the subsequent research on additive screening and mechanism.

关 键 词：芯片互连 添加剂 电化学方法 理论计算 先进表征 

分 类 号：TQ153[化学工程—电化学工业] TN405[电子电信—微电子学与固体电子学]