Sn基无铅焊料的研究进展  

Research Progress of Sn-based Lead-Free Solder

作　　者：溥存继 李才巨[1] 彭巨擘 张欣 郭绍雄 易健宏[1] Pu Cunji;Li Caiju;Peng Jubo;Zhang Xin;Guo Shaoxiong;Yi Jianhong(Faculty of Materials Science and Technology,Kunming University of Science and Technology,Kunming 650093,China;Yunnan Tin Group(Holding)Co.,Ltd,Kunming 650299,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业集团(控股)有限责任公司,云南昆明650299

出　　处：《稀有金属材料与工程》2023年第9期3302-3315,共14页Rare Metal Materials and Engineering

基　　金：云南省重大科技专项(202002AB080001,202202AB080001);云南省中青年学术和技术带头人后备人才项目(202005AC160039);云南锡业集团科技项目(YT-2021-15).

摘　　要：随着世界各国“限铅令”的颁布,Sn基无铅焊料被广泛研究以代替传统Sn-Pb焊料。然而,近年来大规模集成电路及先进电子封装架构的发展对无铅焊料的性能提出了更高要求。本文介绍了Sn-Sb、Sn-Cu、Sn-Ag、Sn-Zn、Sn-Bi和Sn-In系等主要无铅焊料体系的最新研究进展,综述了添加合金元素、稀土元素以及纳米颗粒对焊料显微组织、润湿性能、力学性能、耐蚀性能和接头服役性能的影响。最后讨论了高性能无铅焊料的研发方向,提出了创新的研究理念及研究方法,为下一代钎焊材料的研发提供了参考。With the promulgation of the“Pb Restriction Laws”in various countries around the world,Sn-based lead-free solders have been widely studied to replace traditional Sn-Pb solders.However,the development of large-scale integrated circuits and advanced electronic packaging structures in recent years has placed higher demands on the performance of lead-free solders.This review introduced the latest research progress on the main lead-free solder systems,such as Sn-Sb,Sn-Cu,Sn-Ag,Sn-Zn,Sn-Bi,and Sn-In systems.The effects of adding microalloying elements,rare earth elements,and nanoparticles on the microstructure,wettability,mechanical properties,corrosion resistance,and service performance of solder were also reviewed.The main development trends of high-performance lead-free solder were discussed,and the innovative research concepts and the methods were proposed for the development of next-generation brazing materials.

关 键 词：锡合金 无铅焊料 组织结构 微合金化 焊接性能 

分 类 号：TG425[金属学及工艺—焊接]