基于数字中频预处理专用芯片的SiP设计  

Design of SiP Based on Intermediate Frequency Pre-Processing ASIC

作　　者：张帆[1] ZHANG Fan

机构地区：[1]中国电子科技集团公司第二十研究所,西安710068

出　　处：《现代导航》2023年第5期358-362,380,共6页Modern Navigation

摘　　要：随着电子科学技术的快速发展,系统级封装(SiP)技术成为实现信号处理系统小体积、轻重量、低功耗及低成本方面要求的又一有效途径。针对数字中频预处理应用要求,提出了一种将波形产生、数字滤波处理、数字信号上传和下发及时钟和同步等复杂预处理功能集成设计的方法,采用PBGA225封装形式,大大缩小了系统体积和功耗。With the fast development of electromagnetic technology,System in Package(SiP)becomes another effective way to realize small size,light weight,low power and low cost in signal processing system.Aimed at matching the application request of digital intermediate frequency pre-processing system,a method of integration of wave generation,digital filter,uploading and distribution of digital signal thus clock and synchronization is proposed.PBGA225 package which decreases the volume and power obviously is adopted.

关 键 词：中频预处理专用芯片 系统级封装 微系统仿真 

分 类 号：TN915.04[电子电信—通信与信息系统]