纳米铜焊膏烧结互连技术研究现状与展望  

Research Status and Prospect of Nano Cu Paste Sintering Interconnection Technology

作　　者：牟运 彭洋 刘佳欣 陈明祥[1] MOU Yun;PENG Yang;LIU Jiaxin;CHEN Mingxiang(School of Mechanical Science and Engineering,Huazhong University of Science and Technology,Wiuhan 430074,China;School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]华中科技大学机械科学与工程学院,武汉430074 [2]华中科技大学航空航天学院,武汉430074

出　　处：《集成技术》2023年第5期12-26,共15页Journal of Integration Technology

基　　金：国家自然科学基金项目(62204090);航天科技集团应用创新计划项目(09428ADA);中国博士后面上资助项目(2021M701308)。

摘　　要：纳米铜焊膏在低温烧结后可形成耐高温、高导电导热同质互连结构,该互连结构不仅可避免锡基焊料层和烧结银层服役过程中出现桥接短路和电迁移的可靠性问题,还可解决异质互连结构热膨胀系数不匹配的问题,在集成电路和功率器件封装领域具有重要应用价值。近年来,在铜纳米颗粒稳定性和低温烧结性能方面,纳米铜焊膏烧结互连技术取得了重大研究进展。但与纳米银焊膏烧结互连技术相比,纳米铜焊膏的稳定性、低温烧结性能和可靠性仍有较大提升空间。该文从烧结互连机理、烧结工艺调控、铜纳米颗粒表面改性、纳米铜基复合焊膏、互连可靠性和封装应用方面,阐述了纳米铜焊膏烧结互连技术的最新研究进展,并对后续的技术发展和研究思路进行了展望。After low temperature sintering,nano Cu paste produces the homogeneous interconnection structure with high temperature resistant,high electrical conductivity and thermal conductivity,which can not only avoid service reliability with the bridging problems caused by short circuit and electromigration of tin based solder layer and sintered Ag layer,but also solve the problem of thermal expansion coefficient mismatch of heterogeneous interconnection structure,and has important application value in integrated circuits and power device packaging.In recent years,the sintering interconnection technology of nano Cu paste has made significant research progress in the stability of Cu nanoparticles and low-temperature sintering performances.However,compared with the sintering interconnection technology of nano Ag paste,it still has much room for improving the stability,low temperature sintering performance and reliability of nano Cu paste.This paper describes the important research progress of nano Cu paste sintering interconnection technology from the sintering interconnection mechanism,sintering process optimization,Cu nanoparticle surface modification,nano Cu based composite paste,interconnection reliability,and packaging application,and prospects the follow-up technology development and researchideas.

关 键 词：纳米铜焊膏 烧结互连 集成电路封装 功率器件封装 

分 类 号：TG457.13[金属学及工艺—焊接]