大功率LED芯片直接固晶热电制冷器主动散热  

Active Heat Dissipation of High-Power LED Chip Directly Bonded on Thermoelectric Cooler

作　　者：梁仁瓅 牟运 彭洋 胡涛[1] 王新中[1] LIANG Renli;MOU Yun;PENG Yang;HU Tao;WANG Xinzhong(Information Technology Research Institute,Shenzhen Institute and Information Technology,Shenzhen 518172,China;Shenzhen Institute for Advanced Study,University of Electronic Science and Technology of China,Shenzhen 518110,China;School of Integrated Circuits,Sun Yat-sen University,Shenzhen 518107,China;School of Aerospace Engineering,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]深圳信息职业技术学院信息技术研究所,广东深圳518172 [2]电子科技大学(深圳)高等研究院,广东深圳518110 [3]中山大学集成电路学院,广东深圳518107 [4]华中科技大学航空航天学院,武汉430074

出　　处：《电子与封装》2023年第10期1-7,共7页Electronics & Packaging

基　　金：国家自然科学基金(62204090);中国博士后科学基金(2021M700692);广东省基础与应用基础研究基金(2022A1515110328);深圳市科技计划技术攻关项目(JSGG20201102152403008,JSGG20210802154213040)。

摘　　要：发光二极管(LED)作为新一代绿色固态照明光源,已广泛应用于照明和显示等领域,但散热问题一直是大功率LED封装的关键技术瓶颈。采用大功率LED芯片直接固晶热电制冷器(TEC)的主动散热方法,可增强大功率LED的热耗散,提升大功率LED的发光性能和长期可靠性。利用高精度陶瓷基板和纳米银膏材料制备出高性能TEC,TEC冷端温度最低可达-22.2℃。将LED芯片直接固晶于TEC冷端的陶瓷基板焊盘上,实现LED芯片与TEC的集成封装,制备出LED-TEC主动散热模块。在芯片电流为1.0 A时,由于热电制冷的珀尔帖效应,LED-TEC模块可将LED芯片的工作温度从232℃降低到123℃(降温幅度为109℃),且可使其输出光功率从1087 mW提升到1479 mW,光功率提升幅度达到36.1%。Light-emitting diode(LED)has been considered as a new generation of green solid-state lighting source,which has been widely used in lighting and display and other fields.However,heat dissipation problem is a key technical bottleneck of high-power LED packaging.An active heat dissipation method of high-power LED chip directly bonded on thermoelectric cooler(TEC)is adopted to enhance the heat dissipation of high-power LED,which can improve the optical performance and long-term reliability of high-power LED.High-performance TECs are prepared by utilizing high-precision ceramic substrates and nano-silver paste materials,and the temperature of the TEC cold-side can reach as low as-22.2℃.The LED chip is directly bonded on the cold-side ceramic substrate of TEC.The LED chip and TEC are integrated and packaged to prepare an LED-TEC active heat dissipation module.At a chip current of 1.0 A,due to the Palter effect of thermoelectric cooling,the LED-TEC module can reduce the operating temperature of LED chips from 232℃to 123℃(decreased by 109℃),and the output light power of LED chips can be increased by 36.1%,from 1087 mW to 1479 mW.

关 键 词：大功率LED 主动散热 热电制冷器 芯片固晶 光热性能 

分 类 号：TN305.94[电子电信—物理电子学]