高性能涂层微钻在IC封装基板精密微孔加工应用研究  

Research on Application of High-Performance Coated Micro-Drills in Precise Micro-Hole Processing of IC Packaging Substrates

作　　者：屈建国 胡健 陈成 张辉 金哲峰 Qu Jianguo;Hu Jian;Chen Cheng;Zhang Hui;Jin Zhefeng(Shenzhen Jinzhou Precision Technology Co.,Ltd.,Shenzhen Guangdong 518000,China)

机构地区：[1]深圳市金洲精工科技股份有限公司,广东深圳518000

出　　处：《硬质合金》2023年第5期335-346,共12页Cemented Carbides

基　　金：国家重点研发计划课题(2022YFB3806703);深圳市技术攻关重点项目(JSGG20200914113603008)。

摘　　要：研究微钻不同涂层种类对IC封装基板加工性能及效率的影响。针对几种典型难加工IC封装基板,通过对IC封装基板机械钻孔加工难点、刀具失效机理、不同高性能涂层微钻的性能特点进行分析,设计不同高性能涂层微钻,获得了IC封装基板尤其是难加工封装基板的钻孔品质保障、效率提升、刀具寿命提高方面的有效解决方案。研究结果显示,针对刀具磨损极大的高填料封装基板,金刚石涂层可有效改善微钻的耐磨性能,相对于未涂层微钻和其他类型涂层微钻,刀具寿命显著提升。类金刚石涂层因其较低摩擦系数,有利于切屑的快速排出、降低了加工温度和减小了切削力。对厚径比大、排尘困难的封装基板,如FC-BGA用厚芯板的微孔加工,能有效改善孔壁粗糙度,提升孔位精度,降低断刀率,大幅提升钻孔品质;对于较薄的封装基板如CSP板的微孔加工,能够降低断刀率、增加叠板数量,提升加工效率。The influence of different kinds of coated micro-drills on the processing performance and efficiency of IC packaging substrates was studied.The difficulties in mechanical drilling processing of IC packaging substrates,failure mechanisms of tools,and the characteristics of different high-performance coated micro-drills were analyzed.Highperformance coated micro-drills were designed in view of several typical difficult-to-drill IC packaging substrates.Effective solutions for drilling quality assurance,efficiency improvement,and tool life improvement in drilling IC packaging substrates,especially difficult-to-package substrates,were obtained.The results showed that the wear resistance of the micro-drills could be significantly improved by diamond coating,especially packaging substrates with a high content of fillers that had a great impact on tool wear.Compared with uncoated micro-drills or other coated micro-drills,the tool life was significantly improved by diamond coating.Diamond-like carbon coating,with a low friction coefficient,was conducive to the rapid ejection of chips and the reduction of processing temperature and cutting force.The hole-wall roughness,hole position accuracy,and tool breakage rate were improved apparently when micro-holes of packaging substrates(such as FCBGA thick-core substrates)with large thickness-to-diameter ratios and difficult dust discharge were drilled.For micro-hole processing of thinner packaging substrates such as CSP,the tool breakage rate was reduced,and both the number of stacked substrates and drilling efficiency were increased by the diamond-like carbon coating.

关 键 词：IC封装基板 FC-BGA CSP 涂层微钻 精密微孔 

分 类 号：TN405[电子电信—微电子学与固体电子学]