可焊性锡镀层失效机理分析与对策  

Failure mechanism analysis and solutions of solderable tin coating

作　　者：宋键 万传云 申薰 Song Jian;Wan Chuanyun;Shen Xun(School of Chemical and Environmental Engineering,Shanghai Institute of Technology,Shanghai 201418,China;Dingya Electronic Materials Co.Ltd.,Wuxi 214000,China)

机构地区：[1]上海应用技术大学化学与环境工程学院,上海201418 [2]无锡鼎亚电子材料有限公司,江苏无锡214000

出　　处：《电镀与精饰》2023年第11期68-73,共6页Plating & Finishing

摘　　要：锡具有良好的延展性、导电性、焊接性,常作为可焊性镀层广泛用于电子焊接行业。在应用过程中,镀层的变色、晶须生长及焊接性能的下降逐步成为人们关注并需要及时解决的技术问题。简要分析了可焊性锡镀层性能失效机理,从电镀工序角度对提高镀层性能稳定的解决策略进行了梳理,并对镀锡层的质量控制技术方向进行了展望。Owing to its good ductility,conductivity and solderability,tin coating is widely used in electronic welding industry as a solderable coating.In practical application,the discoloration of tin coating,whisker growth and solderability reduction have become technical problems that need to be paid attention and to be solved.The failure mechanism of solderable tin coating is briefly analyzed,and the strategy to improve the stability of tin coating is given from the perspective of electroplating process.The development trend of control technology for tin coating quality is prospected.

关 键 词：锡层 晶须生长 可焊性 失效机理 

分 类 号：TQ153.11[化学工程—电化学工业]