精密电铸模芯厚度均匀性的调控  

Adjustment of Thickness Uniformity for Precision Electroformed Mold Insert

作　　者：杨忠豪 蒋炳炎[1,2] 马志高 杨迪 张露 YANG Zhonghao;JIANG Bingyan;MA Zhigao;YANG Di;ZHANG Lu(School of Electrical and Mechanical Engineering,Central South University,Changsha,410083;State Key Laboratory of Precision Manufacturing for Extreme Service Performance,Changsha,410083)

机构地区：[1]中南大学机电工程学院,长沙410083 [2]极端服役性能精准制造全国重点实验室,长沙410083

出　　处：《中国机械工程》2023年第21期2531-2539,共9页China Mechanical Engineering

基　　金：国家自然科学基金(51920105008)。

摘　　要：阴极边缘的电场分布不均匀导致模芯边缘的沉积速率高,严重降低电铸模芯的厚度均匀性。在屏蔽挡板工艺基础上,创新性地设计了具有侧边凹槽的阴极夹具。研究表明,沉积层厚度为0.1 mm时,采用该阴极夹具,在屏蔽挡板情况下的厚度不均匀性仅为4.3%,在无屏蔽挡板情况下的厚度不均匀性为16.5%。基于屏蔽挡板和侧边凹槽屏工艺,电铸成形了厚度1.1 mm、不均匀性小于8.0%的精密注射模芯。In electroforming processes,the nonuniform distribution of electric field at cathode edge led to a higher deposition rate at the edge,which resulted in the nonuniform thickness of electroformed mold insert.A cathode fixture with side grooves on top of the shielding baffle was designed herein.The research results show that the nonuniformity is as 4.3%with the thickness of electrodeposited layer is as 0.1 mm,which is the 16.5%of the nonuniformity without shielding plate.The precision injection mold insert with a thickness of 1.1 mm and thickness nonuniformity less than 8%was successfully fabricated based on the cathode side groove and shielding baffle.

关 键 词：电铸 厚度不均匀性 屏蔽挡板 侧边凹槽 注射模芯 

分 类 号：TQ153.4[化学工程—电化学工业]