毫米波太赫兹集成电路与工艺  

Millimeter Wave and Terahertz Integrated Circuits and Processes

作　　者：洪伟[1] 陈喆[1] 周培根 陈继新[1] 彭志刚 王佐钧 HONG Wei;CHEN Zhe;ZHOU Pei-gen;CHEN Ji-xin;PENG Zhi-gang;WANG Zuo-jun(State Key Laboratory of Millimeter Waves,School of Information Science and Engineering,Southeast University,Nanjing 211111,China)

机构地区：[1]东南大学信息科学与工程学院毫米波全国重点实验室,南京211111

出　　处：《微波学报》2023年第5期1-18,共18页Journal of Microwaves

基　　金：国家自然科学基金(62188102)。

摘　　要：近年来,毫米波已逐渐成为5G/6G移动通信、卫星通信、下一代无线互联网、智慧交通、制导、射电天文等重大工程应用领域的核心支撑技术,太赫兹也逐渐成为研究热点。毫米波太赫兹集成电路(芯片)又是推动各种毫米波太赫兹应用系统快速演进的关键。文章对毫米波太赫兹技术的一些重要应用领域和毫米波太赫兹集成电路的研究进展及相关工艺进行了简要综述,分析了不同工艺下芯片的性能特点及其合适的应用场景。In recent years,millimeter wave has gradually become the core supporting technology for major engineering applications such as 5G/6G mobile communication,satellite communication,next-generation wireless internet,intelligent transportation,guidance,radio astronomy,etc.,and terahertz has gradually become a research hotspot.Millimeter-wave and terahertz integrated circuits(chips)are the key to promoting the rapid evolution of various millimeter-wave terahertz application systems.In this paper,the research progress and related processes of millimeter-wave and terahertz integrated circuits are reviewed,and the performance characteristics of chips under different processes and their suitable application scenarios are analyzed.

关 键 词：毫米波 太赫兹 集成电路 工艺 通信 雷达 

分 类 号：TN40[电子电信—微电子学与固体电子学]