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作 者:龚自强 李柱祥 肖鹏 张骐 詹中伟 孙志华 宇波 GONG Ziqiang;LI Zhuxiang;XIAO Peng;ZHANG Qi;ZHAN Zhongwei;SUN Zhihua;YU Bo(Wuhu State-owned Factory of Machining,Wuhu 241007,China;Shanghai Hangyi Research Institute of High-tech Development,Shanghai 200082,China;Aviation Key Laboratory of Science and Technology on Advanced Corrosion and Protection for Aviation Material,AECC Beijing Institute of Aeronautical Materials,Beijing100095,China)
机构地区:[1]国营芜湖机械厂,安徽芜湖241007 [2]上海航翼高新技术发展研究院,上海200082 [3]北京航空材料研究院航空材料先进腐蚀与防护航空科技重点实验室,北京100095
出 处:《电镀与涂饰》2023年第21期1-6,共6页Electroplating & Finishing
摘 要:采用氨羧配位体系无氰镀液对30Cr Mn Si A钢电镀镉。镀液组成和工艺条件为:CdCl_(2)·2.5H_(2)O 40~50 g/L,NH_4Cl 180~220 g/L,氨三乙酸60~80 g/L,乙二胺四乙酸20~30 g/L,NiCl_(2)·6H_(2)O 50~300 mg/L(即Ni^(2+)12.3~74.1 mg/L), pH 6.5~7.5,室温,电流密度1 A/dm~2,时间15~25 min。通过阴极极化曲线测试、循环伏安分析和霍尔槽试验研究了Ni^(2+)质量浓度对镉电沉积行为和镀液均镀能力的影响,并通过光泽度测定、扫描电镜观察和塔菲尔曲线测量分析了Ni^(2+)质量浓度对Cd镀层外观、表面形貌和耐蚀性的影响。结果表明,镀液中添加适量Ni^(2+)可以在一定程度上改善Cd镀层的外观和耐蚀性,但对其他性能的影响不明显。Ni^(2+)不宜单独用作无氰镀镉的添加剂。Cadmium electroplating was conducted on 30CrMnSiA steel substrate in a cyanide-free bath with amino carboxylic compound as complexing agent.The bath composition and process parameters were as follows:CdCl2ꞏ2.5H2O 40-50 g/L,NH4Cl 180-220 g/L,nitrilotriacetic acid 60-80 g/L,ethylenediaminetetraacetic acid 20-30 g/L,NiCl2ꞏ6H2O 50-300 mg/L(i.e.Ni2+12.3-74.1 mg/L),pH 6.5-7.5,room temperature,current density 1 A/dm2,and time 20 min.The effect of mass concentration of Ni2+on the electrodeposition behavior of cadmium and throwing power of the bath was studied by cathodic polarization curve measurement,cyclic voltammetry,and Hull cell test.The effect of mass concentration of Ni2+on the appearance,surface morphology,and corrosion resistance of Cd coating was studied by glossiness measurement,scanning electron microscopy,and Tafel plot measurement.The results showed that the addition of a suitable amount of Ni2+can improve the appearance and corrosion resistance of Cd coating,but slightly affects other properties of Cd coating.It is not recommended to use Ni2+as an additive alone for cyanide-free cadmium electroplating.
关 键 词:无氰镀镉 镍离子 氨羧类化合物 均镀能力 外观 表面形貌 耐蚀性
分 类 号:TQ153.17[化学工程—电化学工业]
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