带驻留时间约束及清洗工艺的晶圆制造设备调度研究  

Scheduling study for time-constrained wafer fabrication equipments with chamber cleaning operations

作　　者：镇璐[1] 张晓琴 阳罚军 ZHEN Lu;ZHANG Xiaoqin;YANG Fajun(School of Management,Shanghai University,Shanghai 200444,China)

机构地区：[1]上海大学管理学院,上海200444

出　　处：《系统工程理论与实践》2023年第8期2395-2411,共17页Systems Engineering-Theory & Practice

基　　金：国家杰出青年科学基金(72025103)。

摘　　要：组合设备被广泛应用于半导体制造产业.在制造过程中,时常需要对组合设备的加工腔进行清洗,以清除其中残留的微尘颗粒和化学气体,进而提高晶圆质量.对于同时带驻留时间约束及清洗工艺的晶圆制造单臂组合设备,已有学者对其调度问题作过研究.然而,作者是假定清洗工艺可在很短时间内完成.在实际生产中,该假设有时得不到满足.针对此问题,本文首先开发出两种有效的机械手调度策略,并进一步提出算法来分配机械手在每一个加工步骤上的等待时间,从而得到满足驻留时间约束的可行调度.最后给出实例来阐述调度策略的有效性.In semiconductor manufacturing,chamber cleaning operations are frequently performed to clear particles and residual chemical gases in processing chambers of cluster tools.Though the scheduling problem of single-armed cluster tools with wafer residency time constraint and chamber cleaning operations has been addressed,it is assumed that the cleaning operations could complete in a very short time range.In practice,this assumption sometimes has to be relaxed.To further explore this problem,two efficient scheduling approaches are developed and corresponding algorithms are derived,with which a feasible schedule that meets the wafer residency time constraint can be realized.Finally,two illustrative examples are presented to demonstrate the power of the techniques.

关 键 词：调度 晶圆制造 组合设备 清洗工艺 

分 类 号：C93[经济管理—管理学]