微蚀液中硫酸铜晶体回收处理工艺  

Treatment process for copper sulfate recovery in micro-etching solution

作　　者：黄仁浪 陈斐健 何碧红 HUANG Renang;CHEN Feijian;HE Bihong(Meizhou Benchuang Electronics Co.,Ltd.,Meizhou 514000,Guangdong,China)

机构地区：[1]梅州市奔创电子有限公司,广东梅州514000

出　　处：《印制电路信息》2023年第11期58-60,共3页Printed Circuit Information

摘　　要：在印制电路板(PCB)制造过程中,减铜及铜面粗化处理是重要的步骤,线路通过蚀刻掉覆铜板(CCL)多余的铜后形成。传统工艺处理方法易造成铜资源浪费,废水处理成本增加,人员换缸配药水的工时增加。为了使资源能循环利用,对减铜、铜面粗化及回用工艺进行研究,利用硫酸双氧水微蚀液中的铜离子和四氧化硫在饱和状态下形成硫酸铜结晶予以分离回收,通过物理降温,冷凝沉淀析出,从而降低微蚀槽铜离子浓度,以减少排放更换药水的频次。In the manufacturing process of printed circuit board,copper reduction and copper surface roughening treatment are important steps.The circuit trace is formed by etching off excess copper from the copper clad plate.This traditional process treatment method leads to a waste of copper resources,an increase in wastewater treatment costs,and a waste of time for personnel to replace chemicals.In order to recycle resources,this article studies the processes of copper reduction,surface roughening,and reuse.Copper ions in the sulfuric acid hydrogen peroxide micro etching-solution are separated and recycled by forming copper sulfate crystals in a saturated state.Through physical cooling and condensation precipitation,the concentration of copper ions in the micro-etching tank is reduced,lowering the frequency of discharge and replacement of chemicals.

关 键 词：微蚀刻 硫酸铜晶体 物理降温 循环利用 

分 类 号：TN41[电子电信—微电子学与固体电子学]