基于Darveaux模型的BGA焊点寿命预测影响因素研究  

Factors influencing BGA solder joint lifetime prediction based on the Darveaux model

作　　者：何峥纬 邵凤山 华腾飞 刘豪 仇原鹰[1] 李静[1] HE Zhengwei;SHAO Fengshan;HUA Tengfei;LIU Hao;QIU Yuanying;LI Jing(School of Mechatronic Engineering,Xidian University,Xi’an 710071,China)

机构地区：[1]西安电子科技大学机电工程学院,陕西西安710071

出　　处：《微电子学与计算机》2023年第11期128-135,共8页Microelectronics & Computer

基　　金：陕西省自然科学基础研究计划(2023-JC-YB-328);中央高校基本科研业务费专项资金项目(ZYTS23014)。

摘　　要：以微系统封装结构中球栅阵列封装(BGA)焊点为研究对象,对热循环载荷下Darveaux模型疲劳寿命预测方法的影响因素进行了探讨.结合有限元仿真分析,分别讨论了裂纹扩展相关系数、粘塑性应变能密度增量和断裂特征长度对Darveaux模型寿命预测结果的影响,揭示了目前焊点可靠性研究中对Darveaux寿命模型在使用时影响因素考虑不充分的现状,并给出了如何考虑上述影响因素的相关建议.进一步,基于蒙特卡洛抽样的全局敏感度分析方法,研究了不同断裂特征长度下,疲劳寿命对Darveaux模型中材料参数的敏感性.研究结果为热循环载荷下正确使用Darveaux模型来预测微系统封装结构的热疲劳寿命提供了有益的参考,为这些关键因素的确定提供了合理性建议与参考依据.Focusing on Ball Grid Array Package(BGA)solder joints within microsystem packaging structures,this study investigates the factors affecting fatigue life prediction using the Darveaux model under thermal cycling loading conditions.Through finite element analysis,it separately investigates the impact of crack growth correlation coefficients,viscoplastic strain energy density increments,and fracture characteristic lengths on the predictive accuracy of the Darveaux model.This study reveals the current inadequacy in considering influential factors when applying the Darveaux life model in solder joint reliability research and provides relevant recommendations for addressing these factors.Furthermore,employing a Monte Carlo sampling-based global sensitivity analysis method,it studies the sensitivity of fatigue life to material parameters within the Darveaux model under different fracture characteristic lengths.The research findings serve as a valuable reference for accurately predicting the thermal fatigue life of microsystem packaging structures under thermal cycling loads using the Darveaux model.They offer rational suggestions and a reference framework for determining these critical factors.This revised translation maintains the technical content while enhancing fluency and accuracy.

关 键 词：Darveaux模型 BGA焊点 热循环 疲劳寿命预测 

分 类 号：TN401[电子电信—微电子学与固体电子学]