埋孔厚铜绕线线圈板制作方法  

A New method of producing the heavy copper coil PCB

作　　者：赵林飞 Zhao Linfei

机构地区：[1]深圳市迅捷兴科技股份有限公司,广东深圳518054

出　　处：《印制电路资讯》2023年第5期105-109,共5页Printed Circuit Board Information

摘　　要：绕线线圈板,其产品设计特点为厚铜设计(70~350μm),HDI干膜开窗蚀刻镭射工艺,其行业能力为:激光击穿表面铜厚最大12μm,介质层厚度与激光孔深度比1:1,激光孔最大150μm,而线圈板需通过高压需求,铜厚设计在70~350μm,介质厚度在200μm左右,所以选择常规干膜开窗蚀刻镭射开窗产品市场应用面较窄,同时选择干膜开窗蚀刻镭射开窗工艺,还面临受外层图形对准度(±20μm)+钻孔精度(±38μm)+多次压合对准度(±75μm)等诸多对位能力因素影响产品品质,所以目前厚铜线圈99%设计为常规多层板设计。Coil PCB product design features requests as following:1.thick copper foil(70-350μm),2.HDI Comformal process,The HDI industry capability is:1.surface copper thickness up to 12μm,2.aspect ratio(laser drill size VS dielectric thickness)is 1:1,3.max laser drill size 150μm,Due to very high voltage test demand for the coil PCB with design of 70~350μm heavy copper,the dielectric thickness will always be about 200μm.So the operation window is very narrow if you choose laser HDI process.Meanwhile,the option of conformal mask process,will be facing couples of registration problems and quality risks.(such as image alignment±20μm,drilling accuracy±38μm,multiple lamination alignment±75μm etc.)Base on all these factors,99%of the heavy copper coil PCB are designed as conventional multi-layer board.

关 键 词：线圈 厚铜 埋孔 多次压合 

分 类 号：TN4[电子电信—微电子学与固体电子学]