适用于数字T/R组件的小型化三维SiP收发变频模块设计  

Design of Miniaturized 3D SiP Transceiver Frequency Conversion Module for Digital T/R Components

作　　者：宋俊欣 杨旭 潘碑[1] 柳超 SONG Junxin;YANG Xu;PAN Bei;LIU Chao(Nanjing Electronic Devices Institute,Nanjing 210016,China)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《电子与封装》2023年第11期68-73,共6页Electronics & Packaging

摘　　要：研究并实现了适用于数字T/R组件的2种小型化三维系统级封装(SiP)收发变频模块的设计。为了获得更高的隔离度与杂散指标,设计了2种SiP变频模块,分别实现Ku波段和S波段的一次变频功能,模块内部集成双向放大器、滤波器和混频器等。SiP变频模块采用三维垂直互联、板级堆叠工艺(POP)、LC滤波器等多种技术,每个模块的尺寸仅有14.2 mm×8.5 mm×3.8 mm。2种SiP模块组合使用可实现信号在Ku波段至125 MHz的2次收发变频功能,8.5 mm的宽度非常适用于数字T/R组件。同时给出了SiP模块化数字T/R组件的设计解决方案。The design of two miniaturized three-dimensional system-in-package(SiP)transceiver frequency conversion modules for digital transmission and reception(T/R)components is studied and implemented.In order to obtain higher isolation and stray indexes,two SiP frequency conversion modules are designed to realize the primary frequency conversions of Ku band and S band respectively,and the modules integrate bidirectional amplifiers,filters and mixers,etc.SiP frequency conversion modules use a variety of technologies,such as 3D vertical interconnection,package on package(POP)and LC filters,the size of each module is only 14.2 mm×8.5 mm×3.8 mm.The combination of the two SiP modules realizes two transceiver frequency conversions from Ku band to 125 MHz,and the width of 8.5 mm is very suited for digital T/R components.The design solution of SiP modular digital T/R components is given.

关 键 词：SiP模块 三维堆叠 球栅阵列结构封装技术 数字T/R 

分 类 号：TN702[电子电信—电路与系统]